Sticking-element section sample, its making method and viewing method

A manufacturing method and surface-mounting technology, which are applied in surface-mounting component section preparation, surface-mounting component section-section sampling preparation method and observation field. The electrode morphology is clear and beautiful, and the clarity is improved.

Inactive Publication Date: 2006-08-09
HUAWEI TECH CO LTD
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0023] The present invention is proposed in view of the technical problem in the prior art that the definition of surface mount component section sample preparation is not high when the surface mount component is analyzed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sticking-element section sample, its making method and viewing method
  • Sticking-element section sample, its making method and viewing method
  • Sticking-element section sample, its making method and viewing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] Referring to FIG. 5 , the cross-sectional sample preparation A of surface-mount resistors according to the prior art includes a colorless and transparent epoxy resin matrix 20 and surface-mount resistors 1 embedded in the matrix 20. flush. Surface mount resistor cross-section samples B, C and D according to the present invention include colored and transparent epoxy resin substrates 21 , 22 and 23 and surface mount resistors 1 embedded in the substrates 21 , 22 and 23 .

[0048] see Figure 6 , taking surface mount resistor section sample preparation as an example, describe the preparation method of surface mount component section sample preparation according to the present invention. The method comprises the steps of:

[0049] Step S200, providing a mold for potting;

[0050] Step S205, apply a release agent in the inner cavity of the mold, so that the sample preparation can be released from the mold in the subsequent procedure;

[0051] Step S210, placing the surf...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

Present invention discloses a surface stuck component section sampling, manufacture and viewing method. In Surface stuck component section sampling, said surface stuck component embeds in transparent colour basal body, one side section of surface stuck component being equal high with basal body. Microscope is used for viewing the front side of surface stuck component section and back incident light is added in sampling back. Section sampling constructional definition made by said invention is greatly raised, having more clear and esthetic appearance of interface and terminal electrode pattern between each layer material in surface stuck component, being very useful for surface stuck resistive failure analysis (FA) and destruction physical analysis (DPA).

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a section sample preparation of a surface mount component, and a preparation method and an observation method for the section sample preparation of the surface mount component. Background technique [0002] Surface mount component is the abbreviation of surface mount component. This type of electronic component is mounted on the circuit board during application, so it is convenient for the installation of electronic components and the wiring of the circuit board, and can save the effective space inside the product, so that the product The structure is compact and the volume is greatly reduced, so it is widely used in modern electronic products. [0003] There are a lot of surface mount components in modern electronic products, so failures often occur. In order to find out the cause of failure, failure analysis (FA) and destructive physical analysis (DPA) are requir...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/28G01N1/00G01N21/00
Inventor 邓永孝王宏全黄创君杜海涛
Owner HUAWEI TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap