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Lead-free golden-plating materials

A technology of spraying gold materials and components is applied in the field of preparation of metal materials for end-face spraying of metallized film capacitors, which can solve the problems affecting the promotion of lead-free gold spraying, reducing the qualified rate of finished products, and increasing the difficulty of processing, so as to achieve a stable product structure. Reliability, improved tensile strength, reduced tin content

Inactive Publication Date: 2006-08-16
戴国水
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Higher tin content means higher price, which affects the promotion of lead-free gold spraying to some extent
[0003] It is also possible to reduce the cost of lead-free gold spray materials by reducing the content of tin, but due to the reduction of tin content, the processing difficulty is greatly increased, and it is easy to include inclusions and surface peeling, which reduces the qualified rate of finished products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Embodiment 1: the composition of each component is respectively by weight percentage: tin (Sn) 20%, antimony (Sb) 1%, copper (Cu) 0.06%, the impurity that total amount is not more than 0.05%, all the other are zinc ( Zn), the weight percentage summation of each component is 100%.

Embodiment 2

[0013] Embodiment 2: The composition of each component is calculated by weight percentage: 30% tin, 0.8% antimony, 0.06% copper, the total amount of impurities is not more than 0.05%, and the rest is zinc.

Embodiment 3

[0014] Embodiment 3: The composition of each component is calculated by weight percentage, respectively: 35% tin, 0.3% antimony, 0.06% copper, the total amount is not more than 0.05% impurity, and the rest is zinc.

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PUM

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Abstract

A lead-free metal spraying stuff includes the Sn, Sb, Cu, Zn and so on. The weight percentage of the composition is Sn 20-90%, Sb 0.1-1%, Cu 0.01-0.1%, the impurity is less than 0.05%, the residue is Zn; the weight percentage of the impurity is Fe<=0.01%, Si<=0.01%, Pb<=0.03%, the cadmium<=0.002%.the invention can decrease the electrical resistivity and improve the strength by decreasing the content of the Cu and Ti, also it can decrease the content of Sn to 20%, so it can save the cost.

Description

technical field [0001] The invention relates to a lead-free gold-spraying material, which belongs to the technical field of preparation of metal materials for spraying the end faces of metallized film capacitors. Background technique [0002] Metallized film capacitor end surface spraying metal materials that have been widely used, the typical traditional product is lead-based five-component gold spraying material, which contains more than 50% lead by weight, and lead is highly toxic to the human body, so it is being used as lead-free Gold spray material is fully replaced. Chinese patent ZL02111554.0 provides a lead-free gold spray material, its electrical and mechanical properties are superior to traditional lead-based five-component gold spray materials, and its melting point is close to that of lead-based five-component gold spray materials. The adjustment of process parameters can adapt to the use of most of the gold spraying machines that origin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/00C22C18/00C22C30/06B23K35/22H01G4/33
Inventor 戴国水金成焕
Owner 戴国水
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