Lead-free golden-plating materials
A technology of spraying gold materials and components is applied in the field of preparation of metal materials for end-face spraying of metallized film capacitors, which can solve the problems affecting the promotion of lead-free gold spraying, reducing the qualified rate of finished products, and increasing the difficulty of processing, so as to achieve a stable product structure. Reliability, improved tensile strength, reduced tin content
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Embodiment 1
[0012] Embodiment 1: the composition of each component is respectively by weight percentage: tin (Sn) 20%, antimony (Sb) 1%, copper (Cu) 0.06%, the impurity that total amount is not more than 0.05%, all the other are zinc ( Zn), the weight percentage summation of each component is 100%.
Embodiment 2
[0013] Embodiment 2: The composition of each component is calculated by weight percentage: 30% tin, 0.8% antimony, 0.06% copper, the total amount of impurities is not more than 0.05%, and the rest is zinc.
Embodiment 3
[0014] Embodiment 3: The composition of each component is calculated by weight percentage, respectively: 35% tin, 0.3% antimony, 0.06% copper, the total amount is not more than 0.05% impurity, and the rest is zinc.
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