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Semiconductor sensor

A semiconductor and sensor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as increased production costs

Inactive Publication Date: 2006-08-23
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In a semiconductor sensor with a MEMS structure, it is necessary to remove the sacrificial layer caused by hydrofluoric acid during the formation of its movable parts. Since the use of aluminum with high solubility in hydrofluoric acid is limited, it has to use a higher prices of metals, leading to increased production costs

Method used

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  • Semiconductor sensor
  • Semiconductor sensor
  • Semiconductor sensor

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Embodiment Construction

[0029] The present invention corresponding to the object and advantages can be understood by referring to the accompanying drawings, and the description of the present preferred embodiments shown below will be understood.

[0030] Below, refer to Figure 1 ~ Figure 4 , the semiconductor sensor according to the first embodiment of the present invention will be described in detail. The semiconductor sensor of the first embodiment is used in a capacitance detection type semiconductor microphone. like figure 1 , 2 As shown, the semiconductor microphone is a packaging module 10 in which a microphone chip 15 and an IC chip 16 are packaged. The microphone chip 15 functions as a semiconductor sensor.

[0031] Outside the packaging module 10, the printed circuit substrate 11 and the cover 12 mounted on the printed circuit substrate 11 are exposed. A sound hole 14 is formed on one side of the cover 12 .

[0032] like figure 2 As shown, the printed circuit substrate 11 and the co...

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Abstract

A semiconductor sensor for improving manufacturing productivity. Opposing electrodes, or a diaphragm electrode and a fixed electrode, form an electrostatic capacity sensing semiconductor microphone on a microphone chip. A through electrode is formed on the microphone chip by a conductor extending between the upper and lower surfaces of the semiconductor substrate. The through electrode directly and electrically connects a MEMS configuration formed by the diaphragm electrode to the wiring of a printed wiring board without using wire bonding.

Description

technical field [0001] The present invention relates to a semiconductor sensor having a diaphragm formed on a semiconductor substrate, and more particularly to an improvement in an electrical connection structure for improving productivity of the semiconductor sensor. Background technique [0002] In recent years, MEMS (Micro Electro Mechanical System: Micro Electro Mechanical System) technology, which forms mechanical parts (movable parts) and electronic parts on a semiconductor substrate, has advanced, and tiny semiconductor sensors with a diaphragm formed on a semiconductor substrate have been developed. Practical examples of diaphragm-type semiconductor sensors are acoustic sensors, pressure sensors, acceleration sensors, and the like. [0003] An example of a diaphragm-type acoustic sensor is a capacitance detection type semiconductor microphone disclosed in Japanese Patent Application Publication No. 60-500841. A capacitance-sensing type semiconductor speaker includes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R1/02G01L19/14H01L23/00
CPCH01L2924/0002H01L2224/16225H01L2224/73204H01L2224/32225
Inventor 松原直辉
Owner SANYO ELECTRIC CO LTD