Transmission platform for semiconductor wafer processing

Abstract

The related transmission platform for a semiconductor wafer processing comprises: a port for wafer-cabin opening and loading, some reaction chambers, and a vacuum axisymmetrical polygonal transmission cavity. Wherein, arranging some vacuum manipulators, some wafer temporary areas, two vacuum locks on nearby polygonal edges, and the reaction chambers on other edges; applying the manipulators near the lock for transmission among the lock, nearest chamber and the temporary area, and other manipulators for transmission among the near areas and chambers. This invention has more wide application area and well compatibility.

Description

technical field [0001] The invention relates to semiconductor wafer processing equipment, in particular to a transmission platform for semiconductor wafer processing. Background technique [0002] During the processing of semiconductor wafers, the process reaction is carried out from the chip cabin to the reaction chamber. After the process is completed, the wafer is transferred from the reaction chamber back to the chip cabin. The vacuum transfer chamber is an important part of the wafer transfer process. The central nervous system of the transmission system, which acts as a transportation hub. The specific transfer process is as figure 1 shown. [0003] At present, most of the semiconductor 300mm adopts such as figure 2 , image 3 Structure. [0004] pass figure 2 It can be seen that the vacuum transmission chamber is a regular polygonal structure. The vacuum manipulator is located in the middle of the vacuum chamber. Two vacuum lock chambers and multiple process...

AI Technical Summary

Problems solved by technology

[0006] In the above transfer structure, one manipulator is responsible for the transfer of all wafers, the exchange of wafers in the vacuum lock chamber is frequent, and the number of wafers processed at the same time is limited, so the production efficiency is difficult to improve

Images