Electroless deposition methods and systems
A technology of electroless plating and substrate, applied in the direction of printed circuit, electrical components, printed circuit manufacturing, etc., can solve the problems of complexity, performance, cost, etc.
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Embodiment 1
[0058] By dissolving 1-5 g / LSnCl in a solution of approximately 1 mL of concentrated HCl (~37%) per liter of solution 2 2H 2 O Prepare a first solution of electroless plating catalyst salt. This first solution is placed in the first inkjet print head. By dissolving 1 g / L PdCl in a solution of approximately 1 mL concentrated HCl (~37%) per liter of solution 2 A second solution of electroless plating catalyst salt is prepared. This second solution is placed in the second inkjet print head. Solvated metal compositions comprising the components shown in Table 1 were prepared.
[0059] components
[0060] The glass substrate was heated using a hot plate and kept at about 60 °C. The metal composition is then placed in a third inkjet printhead. A reducing agent composition of 0.0065 ± 0.0010 M hydrazine was also placed in the fourth inkjet print head. The first solution was printed in a simple circuit pattern on a glass substrate. After about 30 seconds, rinse the s...
Embodiment 2
[0062] First and second solutions of electroless catalyst salts were prepared as in Example 1 and placed in the printhead. Solvated metal compositions comprising the components shown in Table 2 were prepared.
[0063] components
[0064] The polyimide substrate was heated and maintained at about 70°C. The metal composition is then placed in a third piezoelectric inkjet printhead. A 0.05% aqueous hydrazine reducing agent composition was also placed in the fourth piezo inkjet print head. The first solution was printed in a simple circuit pattern on a polyimide substrate. After 1 minute, the substrate was rinsed with water, and a second solution was printed onto the same area. After about 30 seconds, the substrate was again rinsed with water and dried. A metal solution is then printed on the same pattern. The reducing agent solution was then immediately printed on the pattern and the substrate was allowed to rest for 1 minute. The substrate was then rinsed to form...
Embodiment 3
[0066] The electroless active layer is formed by physical vapor deposition of palladium on a silicon substrate. Solvated metal compositions comprising the components shown in Table 3 were prepared.
[0067] components
[0068] The silicon substrate is heated and maintained at about 45°C. The metal composition is then placed in the first thermal inkjet printhead. A reducing agent composition with 0.01 M hydrazine was also placed in the second thermal inkjet print head. The metal solution was printed on a circuit pattern with a trace width of about 1 mm. The reducing agent solution was then immediately printed on the pattern and the substrate was allowed to rest for 1 minute. The substrate was then rinsed to form silver metal traces 70nm deep.
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