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Substrate positioning device, substrate positioning method and program

The technology of a positioning device and a positioning method is applied in the directions of optics, instruments, and photoplate-making process of pattern surface, etc., and can solve the problems such as inability to detect the peripheral part of the wafer.

Active Publication Date: 2006-11-01
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, compared with an opaque wafer made of an opaque material such as silicon, a transparent wafer transmits light almost entirely, so the light transmission sensor cannot detect the peripheral edge of the wafer.

Method used

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  • Substrate positioning device, substrate positioning method and program
  • Substrate positioning device, substrate positioning method and program
  • Substrate positioning device, substrate positioning method and program

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Embodiment Construction

[0100] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. However, in this specification and the drawings, the same reference numerals are assigned to components having substantially the same functional configuration, and repeated explanations are omitted.

[0101] (Example of configuration of substrate processing equipment)

[0102] First, a configuration example of a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. Here, a substrate processing apparatus in which at least one vacuum processing unit is connected to a transfer chamber will be described as an example. figure 1 A cross-sectional view showing a schematic configuration of a substrate processing apparatus according to this embodiment. This substrate processing apparatus 100 has one or two or more vacuum processing units 110 for performing various processes such as...

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Abstract

The substrate alignment device of the present invention prevents a disturbance portion caused by abnormal data such as saturation data from being mistakenly determined as a notch mark formed on the periphery of a substrate and improves the determination accuracy of the notch mark. The peripheral edge of the wafer (W) placed on the rotary stage (210) is detected by a light-transmitting sensor (250), the detected value is obtained as substrate peripheral shape data, and sudden abnormality data is detected from the substrate peripheral shape data, The detected sudden abnormal data is deleted, and the interference reduction processing of the part is tweened based on the prediction data obtained from the peripheral data; the notch mark candidates are detected from the substrate peripheral shape data after the interference reduction processing, and the corresponding part of the notch mark candidates is determined. Data group curve approximation, whether the error between the obtained approximation curve and the data group of the notch mark candidate part satisfies the predetermined judgment condition;

Description

technical field [0001] The present invention relates to a substrate positioning device, a substrate positioning method, and a program for detecting notch marks formed on the periphery of a substrate such as a wafer, and positioning the substrate based on the detected notch marks. Background technique [0002] The substrate processing apparatus carries substrates such as wafers, such as substrates to be processed, used to manufacture semiconductor devices, into a processing chamber through a conveying member such as a conveying arm, and performs predetermined processes such as etching and film formation on the carried wafers. Especially in recent years, with the miniaturization of circuit patterns, high-level microfabrication technology has become indispensable. Therefore, in the case of performing the above-mentioned processing on the wafer or in the case of inspection, etc., the orientation of the wafer When positioning, position setting accuracy corresponding to the precis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68
CPCG03F9/7011H01L21/681H01L21/68
Inventor 长田圭司西中山康彦池田岳高桥裕之
Owner TOKYO ELECTRON LTD
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