Heat pipe device for electronic refrigerator and making method thereof
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG XINBAO ELECTRICAL APPLIANCES HLDG CO LTD
- Publication Date
- 2006-11-15
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to a heat pipe device of an electronic refrigerator and a manufacturing method thereof. Background technique
[0002] The heat pipe of a common electronic refrigerator is attached to the hot end of the refrigerating semiconductor through a liquid storage chamber. Drawing out the cavity, this kind of manufacturing process and structure is relatively simple, but the yield is relatively low, and the wall thickness of the drawn cavity is different, the heat transfer efficiency is not ideal, and the quality is not easy to control, which makes users Not so satisfied. Contents of the invention
[0003] The object of the present invention is to provide a heat pipe device for an electronic refrigerator with simple and reasonable structure, high production efficiency, low production cost, stable quality and high heat exchange efficiency, so as to overcome the shortcomings in the prior art.
[0004] A heat pipe device for an electronic r...