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Heat pipe device for electronic refrigerator and making method thereof

A technology of heat pipe device and electronic refrigerator, which is applied to the operation mode of the machine, the machine using the electric/magnetic effect, the refrigerator, etc., can solve the problem of uneven wall thickness of the cavity, unsatisfactory heat transfer efficiency, and unsatisfactory users. and other problems, to achieve the effect of good heat exchange efficiency, convenient and sufficient condensation, simple and reasonable structure

Active Publication Date: 2006-11-15
GUANGDONG XINBAO ELECTRICAL APPLIANCES HLDG CO LTD
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  • Abstract
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Problems solved by technology

[0002] The heat pipe of a common electronic refrigerator is attached to the hot end of the refrigerating semiconductor through a liquid storage chamber. Drawing out the cavity, this kind of manufacturing process and structure is relatively simple, but the yield is relatively low, and the wall thickness of the drawn cavity is different, the heat transfer efficiency is not ideal, and the quality is not easy to control, which makes users Not so satisfied

Method used

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  • Heat pipe device for electronic refrigerator and making method thereof
  • Heat pipe device for electronic refrigerator and making method thereof
  • Heat pipe device for electronic refrigerator and making method thereof

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0028] see figure 1 - Fig. 6, the heat pipe device of the electronic refrigerator, including the heat pipe arranged on the hot end of the refrigeration semiconductor, the heat pipe is provided with fins, and the heat pipe includes the evaporation pipe 1 for the evaporation of the refrigerant and the condensation pipe 2 for the condensation of the refrigerant , the heat pipe is connected to the hot end of the refrigeration semiconductor through a prefabricated liquid storage chamber. The liquid storage chamber includes two columnar chambers on the left and right. They are connected through a communication pipe 5, and the communication pipe 5 is located at the middle and lower parts of the two chambers.

[0029] A heat-conducting outer wall 6 is arranged on the outside of the liquid storage chamber, and the heat-conducting outer wall is bonded to the hot...

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Abstract

The present invention relates to a heat tube device of electronic refrigerator. It includes heat tube set on the heat end of refrigeration semiconductor, on the heat tube several fins are set. Said heat tube includes evaporation tube for evaporating refrigeration working medium and condenser tube for condensing refrigeration working medium. Said heat tube is connected with the refrigeration semiconductor heat end by means of a prefabricated liquid storage tank, said liquid storage tank includes left and right two cavity chambers, the evaporation tube and condenser tube are respectively connected with said two cavity chambers, said two cavity chambers are communicated by means of communicating tube between them, said invention is simple in structure, stable in quality and good in heat exchange efficiency.

Description

technical field [0001] The invention relates to a heat pipe device of an electronic refrigerator and a manufacturing method thereof. Background technique [0002] The heat pipe of a common electronic refrigerator is attached to the hot end of the refrigerating semiconductor through a liquid storage chamber. Drawing out the cavity, this kind of manufacturing process and structure is relatively simple, but the yield is relatively low, and the wall thickness of the drawn cavity is different, the heat transfer efficiency is not ideal, and the quality is not easy to control, which makes users Not so satisfied. Contents of the invention [0003] The object of the present invention is to provide a heat pipe device for an electronic refrigerator with simple and reasonable structure, high production efficiency, low production cost, stable quality and high heat exchange efficiency, so as to overcome the shortcomings in the prior art. [0004] A heat pipe device for an electronic r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02F28D15/02
Inventor 郭建刚潘卫东
Owner GUANGDONG XINBAO ELECTRICAL APPLIANCES HLDG CO LTD
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