Memory module assembly and manufacturing method thereof

Abstract

The invention discloses an internal memory component, which is characterized by the following: the component contains one or more integral circuit (IC) with one or two radiation piece affixing internal memory through binding agent; the binding agent is acted by heat activating or hardening, which is applied on the internal memory IC or radiating piece to clamp and press between radiating piece and internal memory mode through chuck; the fixing treating device and internal memory mode are sent in the baker, which activates or hardens the binding agent; the fixing treating device can be detached after cooling, which forms internal memory component with radiation piece and internal memory mode.

Description

technical field [0001] The present invention relates to industry standard memory modules for expanding the memory capacity of personal computers (PCs) and other computer systems, and more particularly to memory module assemblies including heat sink structures. Background technique [0002] Heat sinks have been widely used in the heat dissipation of electronic components. Some microprocessors have additional heat sinks to allow higher frequency operation. Other electronic components, such as memory modules, can also benefit from heat sinks. [0003] Most personal computers include slots for more than one memory module, so their owners can add additional memory modules later to increase the memory capacity of the personal computer. Other non-PC devices can also use this type of memory module designed for PCs. High-volume production and product competition will drive down the cost of memory modules, benefiting consumers. [0004] Memory modules can be manufactured in differ...

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