Multilayer press packet, packet structure and multilayer, tool and press for pressing multilayer

A technology of presses and laminates, applied in the field of plate stack structures and presses, can solve the problems of increasing the production cost of multi-layer boards or printed circuit boards, poor thermal conductivity, and time-consuming, so as to reduce processing costs and energy costs , Shorten production and processing time, improve productivity
CN1899809AInactive Publication Date: 2007-01-24M·巴克豪斯
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
M·巴克豪斯
Publication Date
2007-01-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a tool (11a, 11b, 11c) for pressing a multilayer press packet (1b), particularly for placing inside a press (2), preferably for inserting into the insertion opening (3) of a multiplaten press (2a). The multilayer press packet (1b), in particular, has a number of multilayers (7) that are separated from one another by at least one separating plate (6). Advantages are achieved by virtue of the fact that the tool (11, 11b, 11c) can be electrically heated. To this end, at least one electrically operable heating element (10) is provided.
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Description

technical field

[0001] The invention relates to a tool for pressing a multilayer laminate stack, which can be arranged in a press, preferably inserted into an insertion opening of the multilayer press, for the pressing process, wherein the multilayer laminate stack has a plurality of at least A divider separates the set of multilayer boards. In addition, the invention also relates to a stack structure for pressing a multilayer laminated stack using said tool. Finally, the invention also relates to a press for pressing or producing multi-layer boards using the above-mentioned tool or using the above-mentioned stack structure. Background technique

[0002] Various designs of tools or stacks, in particular multilayer laminate stacks, are known from the prior art for producing multilayer boards, preferably for pressing multilayer printed circuit boards. The multilayer boards (multilayer circuit boards) are usually pressed under vacuum in a multilayer press, in which the indivi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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