Quickly configuration method of field programmable gate array

A gate array and configuration data technology, applied in the computer field, can solve the problem of high price, achieve the effect of less operation, lower cost and faster configuration

Inactive Publication Date: 2007-02-14
XI AN JIAOTONG UNIV
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the price of these dedicated configuration devices is generally higher

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Quickly configuration method of field programmable gate array
  • Quickly configuration method of field programmable gate array

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] refer to figure 1 As shown, the single-chip microcomputer in the figure refers to a single-chip microcomputer with an internal program memory. If a single-chip microcomputer without an internal program memory is used, an external program memory should be added to store the single-chip program. Single-chip microcomputer means that the number of I / O pins of the single-chip microcomputer is not less than the sum of the number of non-volatile memory addresses, chip select and output enable pins, and the number of configuration control pins of the FPGA to be configured. If the single-chip I / O pins If the number is less than the sum of the number of non-volatile memory addresses, chip select and output enable pins, and the number of configuration control pins of the FPGA to be configured, the number of I / O pins must be expanded by means of latches, etc., so that the expanded After the total number of I / O pins meet the requirements.

[0023] A0~An in the non-volatile memory m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

This invention relates to a collocation method for field programmable gate array FPGA, which stores the collocation data of the FPGA in a general non-volatile storage and generates the address, slice selection and the output function of the storage via a general type of single-chip processor and the collocation control signal of the FPGA, the output data are input into the data port of the FPGA directly so as to realize the parallel collocation.

Description

technical field [0001] The invention belongs to the technical field of computers, is suitable for use in electronic equipment including a static random access memory (SRAM) process FPGA chip, and particularly relates to a fast configuration method of a field programmable gate array FPGA. Background technique [0002] With the development of microelectronics technology, the task of designing and manufacturing integrated circuits is not completely undertaken by semiconductor manufacturers independently. System designers are more willing to design ASIC chips by themselves, and hope that the ASIC design cycle is as short as possible. It is best to design a suitable ASIC chip in the laboratory and put it into practical application immediately. Programmable gate array FPGA device. Field Programmable Gate Array FPGA is more and more used in the design of electronic products, Field Programmable Gate Array FPGA based on SRAM technology is the current mainstream product. [0003] Du...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 伍卫国李思刘轶钱德沛朱颖
Owner XI AN JIAOTONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap