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Vapor deposition source with minimized condensation effects

A technology of deposition source and steam, applied in the direction of vacuum evaporation plating, coating, electric solid devices, etc., can solve the problems of uneven deposition, uneven deposition, leakage, etc., achieve the effect of improving internal condensation and reducing material condensation

Active Publication Date: 2007-02-28
GLOBAL OLED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In addition, any non-uniformity in heater heat generation or heat absorption of the material to be deposited or distribution of said material within the source may cause non-uniformity of deposition along the length of the source
However, in addition to openings used to transport material vapors, another possible source of inhomogeneity is unintended leakage within source enclosures
If such a leak exists at the source end, the vapor flow from the center of the source to the end of the source can cause a pressure gradient within the source, resulting in non-uniform deposition

Method used

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  • Vapor deposition source with minimized condensation effects
  • Vapor deposition source with minimized condensation effects
  • Vapor deposition source with minimized condensation effects

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Example 1: No End Heater

[0055] A 50 cm long container made of stainless steel sheet material was covered with a split plate / heater assembly. Use Grafoil TM The gasket seals between the lid and the container and is used by Cogemica TM The resulting gasket prevents shorting of the electrical circuit between the lid and the container. The spacer, cover and clamping means are surrounded by holes around the perimeter through which the container is bolted and tightened to secure the cover to the container.

[0056] The open plate has 49 openings, on the central 32 cm of the plate, the center spacing of the openings is 1 cm. The spacing at the ends varies as follows. The respective center positions of openings 1-9 are 0, 6, 12, 19, 26, 34, 42, 51 and 60 mm. The respective center positions of openings 40-49 are 380, 389, 398, 406, 414, 421, 428, 434 and 440 mm. Such an opening spacing pattern is chosen to compensate for the size effect of the finite source which causes...

Embodiment 2

[0067] The same experimental setup as in Example 1 above was used, with the addition of heating the ends of the vessel to reduce condensation of material on the vessel. The rectangular container in Example 1 was replaced by a container with sloped end walls, such as the container shown schematically in FIG. 1 . The angle of inclination of the end walls to the horizontal is about 35 degrees. The source was filled with 200 g of Alq and installed in a vacuum chamber below the sensor array described in Example 1. The conductance ratio and operating pressure at a given rate are as described in Example 1.

[0068] A heating current is applied along the apertured plate, and the output of the source is ramped up to produce a detectable deposition rate on the sensor array. The heating current was used to control the rate, and the average rate increased from zero to about 50A / s within 8 hours, then decreased to between 4-8A / s, and maintained for 14 hours. The rate was then increased ...

Embodiment 3

[0072] The same experimental setup as in Example 1 above was used, with the addition of a structure to heat the sides of the vessel to reduce condensation of material on the vessel. A metal sheet (extension 18 in Figure 2) is spot welded to each end of the opening plate (cover 13 in Figure 2). The source was filled with 200 g of Alq and installed in a vacuum chamber below the sensor array described in Example 1. The conductance ratio and operating pressure at a given rate are as described in Example 1.

[0073] A heating current is applied along the apertured plate, and the output of the source is ramped up to produce a detectable deposition rate on the sensor array. The heating current was used to control the rate, and the average rate increased from zero to about 50A / s within 8 hours, then decreased to between 4-8A / s, and maintained for 14 hours. The rate was then increased again to about 50 A / s in 1 / 2 hour and held at this rate for 12 hours. The rate was then reduced to ...

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Abstract

A thermophysical vapor deposition source for depositing material onto a substrate, said source comprising an elongated container for receiving material (the flow conductance of the container in the direction of elongation is CB) and for heating the material in the container so that The material is vaporized to the heater with partial pressure Pm. The vessel has at least one member having a plurality of openings arranged along its length, the openings having a total conductance of CA, wherein formula (I) and end heaters for heating the sides of the vessel reduce the flow of material on the vessel condensation.

Description

field of invention [0001] The present invention relates to an improved way of vapor depositing material onto a substrate with improved uniformity. Background of the invention [0002] Organic light emitting devices, also known as organic electroluminescent devices, can be constructed by sandwiching two or more organic layers between first and second electrodes. [0003] In a passive matrix organic light emitting device (OLED) with a conventional structure, a plurality of laterally separated light-transmitting anodes (eg, indium tin oxide (ITO) anodes) are formed on a light-transmitting substrate such as a glass substrate as the first electrode. Then at pressures usually below 10 -3 Torr (1.33×10 -1 Two or more organic layers are sequentially formed by vapor deposition of corresponding organic materials from corresponding sources in a decompression chamber of Pa). In addition to doped or undoped organic light-emitting materials, typical organic layers used in the fabricati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C14/12C23C14/00H01L21/76H10K99/00
CPCC23C14/24C23C14/12C23C14/243H01L51/001H10K71/164C23C14/00H01L21/70H01L21/76
Inventor J·M·格雷斯D·R·弗里曼J·H·克卢格N·P·雷登
Owner GLOBAL OLED TECH
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