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Novel polymide film and use thereof

A technology of polyimide film and molecular orientation, applied in the direction of synthetic resin layered products, coatings, chemical instruments and methods, etc., can solve the problems of different dimensional changes, insufficient dimensional changes, stability, etc.

Active Publication Date: 2007-03-21
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] However, Patent Documents 10 to 14 do not describe films that satisfy a specific relationship between the tear propagation resistance value c of the molecular orientation axis and the tear propagation resistance value d in the direction perpendicular to the molecular orientation axis disclosed in the present invention.
In addition, in order to improve the operability and punchability when assembling on the substrate, for example, the dimensional change that occurs when passing through the process of continuously laminating metal on the thin film or the process of etching the metal layer to form a circuit may be suppressed. insufficient
In addition, the amount of dimensional change differs between the ends and the center of the polyimide film, and as a result, it may be difficult to stabilize the rate of dimensional change across the entire width of the film.

Method used

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  • Novel polymide film and use thereof
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  • Novel polymide film and use thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0233]

[0234] 50 moles of p-phenylenediamine (p-PDA) by 50 moles of 4,4-diaminodiphenyl ether (ODA) relative to N, N-dimethylformamide (DMF) as an organic solvent for polymerization %, 50 mol % of terephthalic acid monoester anhydride (TMHQ) and 50 mol % of pyromellitic dianhydride (PMDA) were added, stirred and polymerized to synthesize a polyamic acid solution. In this case, synthesis|combination was performed so that the solid content density|concentration of the obtained polyamic-acid solution might be 15 weight%.

[0235] To this polyamic acid solution, 2.0 equivalents of acetic anhydride and 1.0 equivalents of isoquinoline were added to the amic acid equivalent, and cast on an endless belt with a width of 1100 mm so as to have a thickness of 20 μm. Then, it dried with hot air in the range of 100-150 degreeC for 2 minutes, and obtained the self-indicating gel film (polyimide precursor film). The residual component ratio of this gel film was 54% by weight. The gel fi...

Embodiment 2

[0251] As shown in Table 1, except that the TD shrinkage ratio was 4.40 and the TD expansion ratio was 4.40, a polyimide film was produced in the same manner as in Example 1. In addition, a flexible metal laminate was produced in the same manner as in Example 1 using the obtained polyimide film.

[0252] For these polyimide films and flexible metal laminates, physical property values ​​were evaluated in the same manner as in Example 1. The evaluation results are shown in Tables 2 to 4. From these results, it was revealed that the use of the polyimide film according to the present invention has a small dimensional change rate after etching treatment and a metal laminate in which the dimensional change rate is stable over the entire width.

[0253] The modulus of elasticity of the above polyimide film was 5.9 GPa.

Embodiment 3

[0255] As shown in Table 1, in addition to the TD shrinkage rate of 3.90, the TD expansion rate is 0.00, and the initial temperature in the stretching furnace is 130°C, and then fired in stages at 250°C, 350°C, 450°C and 515°C Except for amination, a polyimide film was produced in the same manner as in Example 1. Moreover, using the obtained polyimide film, it carried out similarly to Example 1, and produced the flexible metal laminated board.

[0256] These polyimide films and flexible metal laminates were evaluated for physical properties in the same manner as in Example 1, and the evaluation results are shown in Tables 2 and 3. This result shows that if the polyimide film according to the present invention is used, the dimensional change rate after the etching treatment becomes small, and the dimensional change rate is stable over the entire width of the flexible metal laminate.

[0257] The modulus of elasticity of the above polyimide film was 6.1 GPa.

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Abstract

It is an object to provide a polyimide film that has little dimensional change in the step of laminating metal on the polyimide film and the step of etching the metal to form a circuit, and can stabilize the rate of dimensional change over the entire width. It is a continuously produced polyimide film. When measuring the linear expansion coefficient a in the direction of the molecular orientation axis and the linear expansion coefficient b in the direction perpendicular to the molecular orientation axis at 100°C to 200°C over the entire width of the film, a and b A polyimide film satisfying a specific relationship, or when the tear propagation resistance value c in the direction of the molecular orientation axis and the tear propagation resistance value d in the direction perpendicular to the molecular orientation axis are measured for the entire width of the film, c and d A polyimide film satisfying a specific relationship can solve the above-mentioned problems.

Description

technical field [0001] The present invention relates to a polyimide film suitable for flexible printed wiring boards, tapes for TABs, substrates for solar cells, and other electrical and electronic equipment substrates, high-density recording media, and magnetic recording media, and its utilization. More specifically, it relates to the process of forming a metal layer, especially the process of laminating metal foil while heating, or the process of etching the metal layer. The dimensional change rate can also be reduced, and the physical property value (dimensional change rate) over the entire width of the film can be reduced. ) stabilized polyimide film. technical background [0002] The requirement for high-density assembly in the field of electronic technology is increasing day by day. Accordingly, for example, physical properties suitable for high-density packaging are also required in the technical field using flexible printed wiring boards (hereinafter referred to as ...

Claims

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Application Information

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IPC IPC(8): B29C55/06B29C41/12B32B15/08B32B27/34C08J5/18H05K1/03C08L79/08
Inventor 藤原宽小野和宏松腋崇晃
Owner KANEKA CORP