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Electronic product with flow-guiding structure and production of flow-guiding structure

A technology of electronic products and manufacturing methods, which is applied to the cooling of electrical equipment shells/cabinets/drawers, electrical components, and instruments, and can solve problems such as increased assembly time, increased production costs, and reduced product yields, and achieve shortened distances, Effects of weight reduction and yield improvement

Inactive Publication Date: 2007-04-04
ACCTON TECHNOLOGY CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the weight of the known deflector iron plate 30 is quite large. For electronic products that are increasingly short, light and thin, the design of the preset distance D must be reserved and the heavy diversion iron plate 30 is quite unfavorable. the elements of
[0004] In addition, since the material of the deflector iron plate 30 is iron, it is necessary to use a specific assembly method during assembly, otherwise it is very easy to damage the electronic component 20 or other electronic parts inside the casing 10, thus increasing the assembly time. and lower product yield
Furthermore, the manufacture of the deflector iron plate 30 requires an additional mold opening to manufacture a stamping die, which increases the production cost a lot

Method used

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  • Electronic product with flow-guiding structure and production of flow-guiding structure
  • Electronic product with flow-guiding structure and production of flow-guiding structure
  • Electronic product with flow-guiding structure and production of flow-guiding structure

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Embodiment Construction

[0029] Please refer to FIG. 2 , which shows a perspective view of an electronic product with a flow guide structure according to the present invention. The electronic product of the present invention has a casing 10, an electronic assembly 20 disposed in the casing 10, a plastic deflector 100, and a bonding part 110 between the bottom surface 18 of the casing 10 and the sticking part 110 of the plastic deflector 100. An adhesive component (not shown), wherein the adhesive portion 110 is extended from the bottom of the plastic deflector 100 to increase the adhesive area between the plastic deflector 100 and the bottom surface 18 of the casing 10 . At least one airflow inlet 12 is provided on the side surface 14 of the casing 10 for introducing the airflow of the external environment. A fan module (not shown) can be installed on the air inlet to enhance the introduction of air. The adhesive component sticks the adhesive part 110 of the plastic deflector 100 in the casing 10 to ...

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PUM

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Abstract

The invention features: using an industrial double-side tape to mount a plastic guide plate made of flame retardant Polypropylene into the case of electronic device in order to form airflow channel; the air flow passes through the electronic component in the case through the air flow entrance on the case to provide cooling function for the electronic components.

Description

technical field [0001] The invention relates to an electronic product with a flow guide structure and a method for making the flow guide structure thereof, in particular to an electronic product using a plastic flow guide plate made of flame-resistant polypropylene (Polypropylene) and its flow guide How the structure is made. Background technique [0002] Using fans to dissipate heat is a technique commonly used in various industrial equipment, especially in widely used electronic products. With the increasing number of applications, more and more electronic components are installed in a single electronic product. Based on space design considerations, these electronic components must be densely installed in the housing of the electronic product. Due to the limited heat dissipation space of the electronic components, several fan modules must be installed in the electronic product, together with the design of the deflector, to increase the flow of air flow through the electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K5/00G12B15/04
Inventor 邬进义张英隆
Owner ACCTON TECHNOLOGY CORPORATION