Apparatus for installing electronic components
A technology for supplying electronic components and components, applied in the direction of electrical components, electrical components, etc., can solve the problems of slow production rhythm, start lag, time lag, etc., and achieve the effect of shortening installation time
Active Publication Date: 2007-04-04
YAMAHA MOTOR CO LTD
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Problems solved by technology
[0005] However, when electronic components are adsorbed or assembled, when the suction nozzle moves in the horizontal direction and when the suction nozzle starts to move in the horizontal direction, when the suction nozzle rises, the lifting mechanism of the suction nozzle or the start of the horizontal axis lags, causing respective delays. time lag
In addition, when the lifting speed of the suction nozzle is increased according to the type of electronic component, the timing is not changed.
As a result, there is a problem of slowing down the production takt
Method used
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[0039] Next, one embodiment of the electronic component assembly apparatus of the present invention will be described with reference to the drawings. Fig. 1 is a plan view of an electronic component assembly device 1, Fig. 2 is a front view of the lower body of the electronic component assembly device 1, Fig. 3 is a right side view of the electronic component assembly device 1, and the feeding on the base 2 of the device 1 On the bases 3A, 3B, 3C, and 3D, a plurality of component supply units 3 are detachably arranged and fixed in a stationary state, and various electronic components are supplied one by one to the component extraction position (component suction position). A supply conveyor 4 , a positioning unit 5 , and an output conveyor 6 are provided between opposing units 3 groups. The supply conveyor belt 4 sequentially transports the printed circuit boards P from upstream to the positioning unit 5, and the positioning unit 5 assembles electronic components on the printe...
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Abstract
The present invention relates to an electronic component assembly device. Based on the lifting mechanism of the suction nozzle or the start-up lag of the horizontal axis, the lifting of the suction nozzle and the movement in the horizontal direction can be started as early as possible, thereby shortening the installation of each electronic component as much as possible. time. When the suction nozzle (15) descends, the CPU (90) sends the suction nozzle lift from the CPU (90) according to the start-up lag time of the suction nozzle lifting motor (51) stored in the RAM (92) to lift the suction nozzle (15). After the operation signal of the motor (51) to the actual start of operation of the nozzle lift motor (51) (NL axis start delay) tZ and after the suction nozzle (15) starts to descend, the time tn1 to reach the distance L3 at the descending speed, The starting position of the lowering of the suction nozzle (15) during the movement is determined, therefore, the starting time of the lowering of the suction nozzle (15) during the movement of the assembly head (16), that is, the movement of the suction nozzle (15) is as early as possible.
Description
technical field [0001] The present invention relates to an electronic component assembly device, which includes: a component supply unit that supplies electronic components to a component suction position; The horizontal axis that moves the nozzle in the horizontal direction is the XY axis. Background technique [0002] Such an electronic component assembling device is known in Patent Document 1, etc., when sucking and holding an electronic component supplied from a component supply unit on a suction nozzle, or assembling the sucked and held electronic component on a printed circuit board. , move the suction nozzle horizontally to the top of the component supply unit or the printed circuit board, then lower the suction nozzle to absorb or assemble the electronic components on the printed circuit board, then raise the suction nozzle, and then move along the Move horizontally to the printed circuit board or component supply unit. [0003] Moreover, after the adsorption nozzl...
Claims
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IPC IPC(8): H05K13/04H05K13/08
CPCH05K13/0452Y10T29/53174H05K13/08Y10T29/53191H05K13/0413H05K13/041H05K13/02
Inventor 家泉一义龟田真希夫福岛吉晴柏谷尚克
Owner YAMAHA MOTOR CO LTD