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Image sensor module, camera assembly using the same, and method of manufacturing the camera assembly

An image sensor and camera technology, applied in image communication, electrical solid-state devices, semiconductor devices, etc., can solve problems such as screen noise

Inactive Publication Date: 2007-05-02
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if the multilayer ceramic capacitor is removed from the image sensor module, screen noise will occur
However, in order to reduce the overall size of the camera assembly including the housing, such problems cannot be avoided

Method used

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  • Image sensor module, camera assembly using the same, and method of manufacturing the camera assembly
  • Image sensor module, camera assembly using the same, and method of manufacturing the camera assembly
  • Image sensor module, camera assembly using the same, and method of manufacturing the camera assembly

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Embodiment Construction

[0050] Referring in detail to the general inventive concept of the present invention, embodiments of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements. The embodiments described below are intended to explain the present general inventive concept by referring to the figures.

[0051] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0052] 【Image sensor module and camera module】

[0053] 3 is an exploded perspective view of a camera assembly including an image sensor module according to the present invention, and FIG. 4 is a cross-sectional view of the camera assembly.

[0054] As shown in FIGS. 3 and 4 , the camera assembly according to the present invention includes: a lens portion 10; a casing 20 into which the lens portion 10 is inserted and installed from an opening of the casing; and an image sensor module 30 connected to the lower portio...

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Abstract

The present invention relates to an image sensor module including a flexible printed circuit board (FPCB) having a window; and an image sensor that is formed to have the same size as the width of the FPCB and is attached on one surface of the FPCB, the image sensor including a light receiving section, which receives light passing through the window, and a signal processing section which processes signals generated by the light receiving section.

Description

[0001] This application claims priority from Korean Patent Application No. 2005-0089837 filed with the Korean Intellectual Property Office on September 27, 2005, the contents of which are incorporated herein by reference. technical field [0002] The present invention relates to an image sensor module (image sensor module) used in digital cameras, mobile devices, and various monitoring equipment, etc., a camera (camera) module using the module, and the manufacture of the camera (camera) module Methods. In the image sensor module, process tolerance generated by existing packaging methods is minimized to prevent optical axis deviation, which can improve productivity. Background technique [0003] With the rapid development of information communication technology, the speed of data communication has increased, and the amount of data communication has expanded. Also, an imaging device such as a CCD image sensor or a CMOS image sensor is mounted on a mobile electronic device suc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/335H05K1/00H01L27/14H04N25/00
CPCH05K2201/10121H05K2201/09072H01L27/14618H01L27/14625H05K1/0274H05K1/189H01L27/14685H04N5/2257H01L2924/0002H04N23/57H01L2924/00
Inventor 金好兼郭亨灿申东民
Owner SAMSUNG ELECTRO MECHANICS CO LTD