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Optical semiconductor device and its manufacture method

A technology of optical semiconductors and manufacturing methods, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as increased processes and increased manufacturing costs, and achieve good operational effects

Inactive Publication Date: 2007-06-06
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, there is a problem that the process increases and the manufacturing cost also increases.

Method used

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  • Optical semiconductor device and its manufacture method
  • Optical semiconductor device and its manufacture method
  • Optical semiconductor device and its manufacture method

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Embodiment Construction

[0024] Hereinafter, the optical semiconductor device and its manufacturing method according to the embodiment of the present invention will be described with reference to the drawings.

[0025] FIG. 1 is a diagram showing the configuration of an optical semiconductor device 10 according to an embodiment of the present invention. FIG. 1( a ) is a plan view of the optical semiconductor device 10 . Fig. 1(b) is an A-A sectional view of the optical semiconductor device 10 shown in Fig. 1(a). The optical semiconductor device 10 is a device in which a bare chip 11 on which a semiconductor element is formed is mounted on a substrate 12 .

[0026] As shown in FIGS. 1( a ) and ( b ), the optical semiconductor device 10 has a bare chip 11 , a substrate 12 , a chip base 13 , electrode terminals 14 , wires 15 , and resin 16 . The bare chip 11 has a light receiving unit 21 , electrode pads 22 , and a signal processing circuit unit 23 .

[0027] The bare chip 11 includes, for example, an...

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PUM

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Abstract

PROBLEM TO BE SOLVED: To provide an optical semiconductor device which prevents malfunction due to light and ensures a desirable operability, and to provide a method for fabrication thereof.SOLUTION: A coating is formed on a receiver 21 on a bare chip 11 having a semiconductor device equipped with the receiver 21, and thereafter it is mounted on a die pad 13 of a substrate 12 having an electrode terminal 14. An electrode pad 22 and the electrode terminal 14 are electrically connected via a wire 15, and thereafter a resin 16 is pasted on the periphery and top of the bare chip 11. Successively, the resin 16 is cured to remove a coating member. Accordingly, the optical semiconductor device 10 is manufactured as defiantly sealed with the resin 16 up to the receiver 21.

Description

technical field [0001] The present invention relates to an optical semiconductor device having a photodiode and the like and a method of manufacturing the same. Background technique [0002] For semiconductor devices, metal parts such as electrode pads and wires need to be protected from corrosion by moisture contained in the external air, or separated from dust contained in the external air. Because of such a need, conventionally, a method of sealing these metal parts with a resin has been employed. For example, Japanese Patent Laid-Open No. Hei 5-136293 discloses a technique in which, when the semiconductor device is an optical semiconductor device having a photodiode or the like, it is sealed with a light-transmitting resin so that the Transmission of light from a light receiving unit mounted on an optical semiconductor device, or transmission of light to a light receiving unit. [0003] In addition, when light is irradiated on the signal wiring of the semiconductor dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/28H01L23/29H01L23/31H01L21/56H01L33/62
CPCH01L2224/48091H01L2924/3025
Inventor 石田智彦
Owner TDK CORPARATION
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