Semiconductor device

Abstract

There are provided semiconductor devices (1, 1A, 21, 31, 41, 51) including a first semiconductor chip (3) having a first function surface (3F) where a first function element (3a) is formed; a protection resin layer (12) formed on the first function surface; bottom exposing surfaces (10B, 19BB) formed on the periphery of the first function surface and exposed from a bottom surface (12B) located at the side opposite to the first function surface side of the protection resin layer; side exposing surfaces (10S, 19BS) exposed from the side surface (12S) of the protection resin layer; and external connection terminals (10, 19, 52) for electrical connection with outside.

Description

technical field [0001] The present invention relates to a semiconductor device having almost the same size as a semiconductor chip. Background technique [0002] In recent years, miniaturization and high mounting density are required for semiconductor devices. As a semiconductor device satisfying such a requirement, there is a chip scale package (CSP, Patent Document 1 below) or a multi-chip module (MCM, Patent Document 2 below). [0003] 12 is a schematic cross-sectional view showing the structure of a conventional semiconductor device having a chip-scale package structure. [0004] The semiconductor device 71 includes a semiconductor chip 72 . A functional element 72 a is formed on one surface of the semiconductor chip 72 , and an insulating film 73 is formed to cover the functional element 72 a. An opening 73 a exposing the electrode of the functional element 72 a is formed in the insulating film 73 . [0005] A rewiring 74 of a predetermined pattern is formed on the ...

AI Technical Summary

Problems solved by technology

[0022] In addition, if a plurality of semiconductor chips 72 are to be mounted on a mounting substrate using the semiconductor device 71 shown in FIG.

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