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A leadless solder

A lead-free solder and raw material technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as high price, environmental pollution, and human harm from heavy metal lead, achieve great social benefits, and easily obtain raw materials , the effect of preventing harm

Inactive Publication Date: 2007-07-11
朱晓明
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] One of the traditional solders that have been widely used in the electronics industry is tin and lead series alloys. This solder alloy has superior mechanical and physical properties. However, because the metal composition contains more lead, the heavy metal lead is harmful to the human body. Larger, the pollution to the environment is becoming more and more serious, therefore, the use of this solder will be gradually restricted until it is banned
In recent years, some lead-free solders have been launched on the market, and some metal materials such as indium or silver are used to replace lead. The metal compositions made can basically meet the requirements of use, but these metal materials are not only expensive, but also difficult to obtain purchased

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] (1) Percentage by weight: 0.05% copper, 1% antimony, 70% tin, and the balance is zinc. Weigh each metal object, then place copper, antimony, and zinc in a crucible for melting, and place tin in a melting pot. melting in a kettle;

[0012] (2) Put the copper, antimony and zinc melts obtained in step (1) into the smelting kettle and mix them with the tin melts (under agitation), and heat and stir at 250-350°C for 20-30 minutes ;

[0013] (3) under the temperature condition of 200~250 DEG C, put the solder alloy finally formed in step (2) into a mold and cast into a cylinder;

[0014] (4) Extrude the cast ingot (ie cylinder) obtained in step (3) at room temperature, and wire-draw it to become lead-free tin soldering wire.

[0015] The performance indicators of the tested lead-free solder are as follows:

[0016] Melting point (°C)

Embodiment 2

[0018] Percentage by weight: 0.03% copper, 0.6% antimony, 69.5% tin, and the balance being zinc, each metal object is weighed. All the other implementations are as in Example 1.

Embodiment 3

[0020] Percentage by weight: 0.08% copper, 1.5% antimony, 71% tin, and the balance being zinc, each metal object is weighed. All the other implementations are as in Example 1.

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Abstract

The invention relates to a leadless solder, formed by 69. 5-71% tin, 0.6-1. 5% antimony, 0.03-0.08% copper and the left is zinc. The invention fuses and mixes said metals to form composite as the solder of electric element. The invention can avoid lead hurting people and pollution, with low cost.

Description

Technical field: [0001] The invention relates to solder for electronic components, in particular to a solder made of tin as a base metal and a composition made of adding several metals. Background technique: [0002] One of the traditional solders that have been widely used in the electronics industry is tin and lead series alloys. This solder alloy has superior mechanical and physical properties. However, because the metal composition contains more lead, the heavy metal lead is harmful to the human body. Larger, the pollution to the environment is becoming more and more serious, therefore, the use of this solder will be gradually restricted until it is banned. In recent years, some lead-free solders have been launched on the market, and some metal materials such as indium or silver are used to replace lead. purchased. Invention content: [0003] The technical problem to be solved by the present invention is to provide a solder for an electronic assembly, which does not ...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 朱晓明
Owner 朱晓明
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