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Encapsulation of the image sensor and detector

A technology of image sensor and sensing area, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of double-chip packaging limitations, the inability to implement 93-wire bonding of the first chip, etc., and achieve Create a convenient effect

Inactive Publication Date: 2007-07-11
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the size of the second chip 95 is equal to or larger than that of the first chip 93, the wire bonding of the first chip 93 cannot be implemented.
As a result, there are more restrictions on dual-chip packaging

Method used

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  • Encapsulation of the image sensor and detector
  • Encapsulation of the image sensor and detector
  • Encapsulation of the image sensor and detector

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0015] Please refer to the first preferred embodiment of the image sensor package of the present invention shown in FIG. 1, the image sensor package 10 includes a substrate 20, a first chip 40, a plurality of leads 50a, 50b, and an adhesive 60a , 60b, a second wafer 70 and a cover 80.

[0016] The substrate 20 can be a ceramic substrate, a printed circuit board or a flame retardant epoxy resin circuit board (Flame Retardant Type 4, FR4). In the first preferred embodiment, the substrate 20 is a single-layer structure. The upper surface of the substrate 20 is provided with a plurality of upper welding pads 201a, 201b, and the position of the upper welding pad 201b is closer to the outside of the substrate 20 than the position of the upper welding pad 201a. A plurality of lower pads 202 corresponding to and electrically connected to the upper pads 201 a and 201 b are disposed on the bottom surface of the substrate 20 opposite to the top surface.

[0017] The first chip 40 , suc...

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PUM

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Abstract

This invention relates to image sensor sealing structure, which comprises one baseboard, one first transistor slice, multiple lead wires, one adhesive glue, one second transistor slice and one cover, wherein, the baseboard is set with multiple weld pads and upper weld pads; the first transistor slice is set on baseboard with multiple first pads connected through each first weld pad; the glue height is higher than that of first transistor slice and upper weld pad; the second transistor is set on top of first transistor slice with one sensor area and multiple weld pads connected to top weld pad and the second transistor sensor area circle is set with adhesive glue.

Description

【Technical field】 [0001] The present invention relates to an image sensor package, in particular to a dual chip image sensor package. 【Background technique】 [0002] Image sensors can detect light sources in space and convert them into electrical signals. They have been widely used in various optoelectronic products and become one of the key components. At present, mobile phones are developing toward multifunctional trends, and mobile phones with camera functions are very popular once they are launched. Camera modules used in mobile phones must not only meet the requirements of thinness, lightness and compactness, but also have better photographic performance. The image sensor package is a major factor determining the size and photographic performance of the camera module. [0003] With the further development of camera functions of mobile phones, such as the increase in demand for high resolution and auto focus, the camera module needs to add a driver chip to meet more fu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L23/488H01L23/31
CPCH01L25/0657H01L2224/48091H01L2224/48227H01L2224/48992H01L2224/8592H01L2225/0651H01L2225/06555H01L2225/06575H01L2225/06582H01L2924/00014
Inventor 吴英政苏英棠
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD