Information handling system interposer enabling specialty processor integrated circuit in standard sockets

Abstract

An information handling system (IHS) has a circuit board assembly with a dual-sided interposer substrate that is inserted between a baseboard and a processor integrated circuit having a second pattern of electrical contacts. The dual interposer substrate formed of a stack of printed circuit boards (PCBs) provides communication channels between a first coupling pad on the baseboard that has a first pattern of electrical contacts and a second coupling pad on top of the dual interposer substrate that provides the second pattern of electrical contacts. The second pattern receives another type of processor integrated circuit than a type supported by the first pattern. Stacked vias formed through the stack of PCBs electrically connect respective electrical contacts of the first and second coupling pads to form a corresponding communication channel. One or more grounded vias mitigate signal integrity (SI) anomalies on the communication channels.

Description

BACKGROUND1. Technical Field[0001]The present disclosure relates in general to a processor integrated circuit in an information handling system (IHS), and more particularly to mounting a specialty processor integrated circuit in an IHS.2. Description of the Related Art[0002]As the value and use of information continue to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems (IHSs). An IHS generally processes, compiles, stores, and / or communicates information or data for business, personal, or other purposes, thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, IHSs may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the informatio...

AI Technical Summary

Benefits of technology

This patent describes a circuit board assembly that includes a baseboard and a dual-sided interposer substrate. The interposer substrate has two or more printed circuit boards with electrical contacts and ground planes. It also includes stacked vias that connect the integrated circuits and grounded vias that improve signal integrity. The technical effect is a more efficient and reliable connection between different types of integrated circuits and better signal communication.

Problems solved by technology

Considerable design and fabrication expense is devoted to developing each baseboard to integrate all of these communication and power signals and other supporting components.

If the demand of the new processor IC is not sufficient, an original equipment manufacturer (OEM) of the baseboards and IHS may not have sufficient incentive to create a new baseboard with a corresponding new socket for the processor IC with the nonstandard pattern.

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