Encapsulation of electronic components in polymer materials
a technology of polymer materials and electronic components, which is applied in the direction of solid-state devices, basic electric elements, electric apparatus, etc., can solve the problems of unsuitable insulating fillers as encapsulating materials, unsuitable encapsulating materials for electronic components, and insufficient strength of two-part polysiloxane resins currently used for this application
Active Publication Date: 2019-03-26
INST VEDECOM
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Problems solved by technology
However in certain applications, such as automotive and aeronautical electronics, the temperature range to which these components are subjected varies widely, i.e., from −70° C. to 300° C., and it has been found that the two-part polysiloxane resins currently used for this application do not have sufficient strength at extreme temperatures.
However, these materials include substantial amounts of electrically conductive thermal and insulating fillers that are unsuitable as encapsulation materials for electronic components.
These compositions include additives such as silane coupling agents, dicarboxylic acid esters, and fillers which are unsuitable as encapsulating materials for electronic components.
They include thermal conductive fillers which are not suitable as encapsulation materials for electronic components.
Method used
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[0031]The polyorganosiloxane resin used in the invention comprises at least three components:
[0032]Part (A) comprises at least one polyorganosiloxane (A1) which comprises at least two —CH═CH2 groups per molecule. The polyorganosiloxane (A1) may be linear or branched, it may be a homopolymer or a copolymer. The unsaturated group may be a vinyl, allyl, butenyl, or hexenyl group. Preferably, the unsaturated group is a vinyl. The unsaturated groups can be placed in an end and / or pendant position with respect to the polyorganosiloxane chain. The other organic groups of the chain (A1) can be chosen in a known manner from saturated, unsaturated, or aromatic monovalent organic groups. Preferably, they are selected from saturated or aromatic monovalent organic groups comprising from 1 to 20 carbon atoms. For example, alkyl groups such as methyl, ethyl, propyl, pentyl, octyl, undecyl, and octadecyl; cycloalkyls such as cyclopentyl and cyclohexyl; aromatic hydrocarbons such as phenyl, tolyl, x...
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Abstract
The invention relates to an electronic component (1) comprising at least one semiconductor chip (4) and at least one substrate (6), the semiconductor chip (4) being encapsulated in a polyorganosiloxane resin (3), which is the result of hardening a composition comprising at least: one portion (A) comprising at least one polyorganosiloxane (A1) which contains at least two —CH═CH2 reactive groups per molecule; one portion (B) comprising a polyorganosiloxane (B1) which comprises at least two Si—H groups per molecule; and at least one hydrosilation catalyst (C1), the components (A1) and (B1) being in quantities such that the molar ratio of Si—H / —CH═CH2 in the composition is no lower than 0.4.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is the US National Stage under 35 U.S.C. § 371 of International App. No. PCT / EP2015 / 077056 filed on Nov. 19, 2015, which claims priority to French application number 1461594 filed on Nov. 27, 2014, the contents of which (text, drawings and claims) are hereby incorporated by reference.BACKGROUND[0002]The present invention relates to the use of polysiloxane-based polymer materials for the encapsulation of power electronics. It relates to articles comprising at least one electronic component encapsulated in a polysiloxane-based polymer material, in particular power modules for automotive and aeronautical electronics, and a method for their manufacture. It relates in particular to the materials obtained from a crosslinked polysiloxane resin formulated in two parts.STATE OF THE PRIOR ART[0003]Heat curable, two-part silicone resins have been used in various industrial applications because of their thermal stability, their diele...
Claims
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IPC IPC(8): H01L23/29C08L83/00C08K5/56C08L83/04H01L21/56C08G77/20C08G77/12H01L23/28H01L33/52H01L33/56H01L23/24
CPCH01L23/296C08G77/12C08G77/20C08K5/56C08L83/00C08L83/04H01L21/56H01L23/28H01L23/29H01L23/293H01L33/52H01L33/56H01L2924/0002C08L2203/206C08L2205/025H01L23/24H01L2924/00C08J3/24C08J2383/05C08J2383/07C08J2483/07C08J2483/05C08L2201/08C08L2205/03C08L2205/05
Inventor FOUET, THOMASBANET, PHILIPPECHIKH, LINDAFICHET, ODILE
Owner INST VEDECOM