Controller of vacuum pump
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[0021] One embodiment of the invention as embodied in a vacuum pump for evacuating a load-lock chamber in a semiconductor production apparatus is described below with reference to the accompanying drawings.
[0022] As shown in FIG. 1, a process chamber 12 is provided side-by-side with respect to a load-lock chamber 13 in a semiconductor production apparatus 11. Deposition processes, such as vacuum deposition or sputtering on a wafer, are carried out in the process chamber 12. Those processes are executed after the process chamber 12 is set to a predetermined degree of vacuum by using an unillustrated evacuation system.
[0023] Wafer exchange between the exterior (atmospheric pressure space) of the semiconductor production apparatus 11 and the process chamber 12 is carried out via the load-lock chamber 13. That is, a passage for exchanging a wafer at the time of wafer exchange is provided between both chambers 12 and 13 and a gate valve 14 that connects and disconnects both chambers 12...
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