Pixel structure and exposure method thereof
a liquid crystal display and pixel technology, applied in non-linear optics, instruments, optics, etc., can solve the problems of large demand for tft-lcd, inability to control the process parameter value about the environment to keep the same, and often generated shot mura defects between any two adjacent masks, so as to improve the abrupt image change situation and not reduce the display quality
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first embodiment
[0034] The first embodiment of the present invention is to form several switching transistors in a pixel region. On the other hand, the linking region of two masks of photolithography process rounds is aligned to between switching transistors. Therefore, the photolithography process for forming each switching transistor is respectively performed. In other words, the switching transistors located in the two sides of the linking region are formed by different photolithography process rounds. The different photolithography process rounds can make the switching transistors have different process parameters. The pixel region is controlled by the two switching transistors. Therefore, the pixel region's optical characteristic is also affected by the two switching transistors. In other words, the optical characteristic of the linking region is determined by the switching transistors located in the two sides of the linking region. The optical characteristic difference in the linking region c...
second embodiment
[0045] The second embodiment of the present invention forms several storage capacitors in a pixel region. On the other hand, the linking region of two masks of photolithography process rounds is aligned to this region among the storage capacitors. Therefore, the photolithography process for forming each pixel capacitor is respectively performed. In other words, the pixel region of the second embodiment is also controlled by a switching transistor; however, the storage capacitors are formed by different photolithography process rounds. The different photolithography process rounds provide the storage capacitors with different process parameters. Therefore, the pixel region's optical characteristic is also affected by the storage capacitors. In other words, the optical characteristic of the linking region is determined by the storage capacitors located on the two sides of the linking region. The optical characteristic difference in the linking region can be released by the process par...
third embodiment
[0056] The third embodiment of the present invention forms several storage capacitors in a pixel region. On the other hand, the linking region of two masks of photolithography process rounds is aligned to this region among the storage capacitors. Therefore, the photolithography process for forming each pixel capacitor is respectively performed. The main point of difference with the second embodiment is that the storage capacitor is composed of a scan electrode and the pixel electrode in the third embodiment. Similarly, the pixel region in the third embodiment is also controlled by a switching transistor. The overlapping region of the pixel electrode and the scan electrode is divided. Therefore, the storage capacitor includes two parts in a pixel region. The two parts are formed by different photolithography process rounds.
[0057]FIG. 5A illustrates a schematic top view diagram of a pixel region of a liquid crystal display in accordance with the third embodiment of the present invent...
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Abstract
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