Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture

Abstract

A microelectronic device package and method for manufacture. In one embodiment, the device package can include a microelectronic substrate having first and second device features, a conductive link that includes a conductive material extending between the first and second device features, and an external cover or enclosure disposed around at least a portion of the substrate and the conductive link. The package can be filled with a liquid or a pressurized gas to transfer heat away from the conductive link. In one embodiment, the enclosure can have a composition substantially identical to the composition of the conductive links and the enclosure can be formed simultaneously with formation of the conductive link to reduce the number of process steps required to form the microelectronic device package. A sacrificial material can temporarily support the conductive link during manufacture and can subsequently be removed to suspend at least a portion of the conductive link between two points.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] The present application is a continuation-in-part of U.S. Application No. 09 / 640,149, filed Aug. 16, 2000 (attorney docket number 10829.8512US) and U.S. application Ser. No. 09 / 382,929, filed Aug. 25, 1999 (attorney docket number 00303.603US1), both incorporated herein in their entireties by reference.TECHNICAL FIELD [0002] This invention relates to microelectronic device packages filled with liquid or pressurized gas, and methods for manufacturing and processing such packages. BACKGROUND OF THE INVENTION [0003] Packaged microelectronic assemblies, such as memory chips and microprocessor chips, typically include a microelectronic substrate die encased in a plastic, ceramic, or metal protective covering. The die includes functional devices or features, such as memory cells, processor circuits, and interconnecting wiring. The die also typically includes bond pads electrically coupled to the functional devices. The bond pads can be coupled...

AI Technical Summary

Benefits of technology

"The present invention is about microelectronic device packages and methods for making them. The invention includes a microelectronic substrate with a microelectronic device feature and a conductive link made of conductive material that is connected to the microelectronic device feature. The conductive link is sealed in an enclosure that contains a gas at a pressure greater than external pressure. The invention also includes a method for making the microelectronic device package by forming a microelectronic device feature on a microelectronic substrate, coupling a conductive link to the microelectronic device feature, and sealing the conductive link and the microelectronic substrate in an enclosure. The invention allows for better protection and performance of microelectronic devices in high-pressure environments."

Problems solved by technology

As these distances decrease, the likelihood for capacitive coupling between adjacent structures increases, which can impair or reduce the maximum performance of the packaged microelectronic device.

Because current chips typically measure over 1 centimeter along an edge, it becomes increasingly difficult to reduce the thickness of the bridges and the spacing between bridges without supporting the bridges at such frequent intervals that the benefits of unsupported bridge segments (e.g., the reduced dielectric constant of the material adjacent to the bridge) are lost.

However, copper has a significantly greater density than aluminum and aluminum alloys, and therefore has only 85% of the unsupported bridge length of an aluminum or aluminum alloy conductor.

Another problem with conventional air bridge designs is that the air adjacent to the wires typically has a lower thermal conductivity than the solid material it replaced.

Accordingly, it can be more difficult to transfer heat from the packaged microelectronic device.

As a result, the microelectronic device may be more likely to overheat, which can reduce the life expectancy and / or performance level of the device.

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