Flash EEPROM with function bit by bit erasing
a flash memory and function technology, applied in the field of spiltgate flash memory cells, can solve the problems of high program voltage of about 12v and high voltage during reads
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[0048] Referring now to the drawings, namely, to FIGS. 4a-4f and 5a-5f first, there is shown steps of forming a split-gate flash memory cell with the capability of being programmed multiple bits in contrast with the capability of the current state of the art of dual bit split-gate flash memory cells. FIGS. 6a-6c and 7a-7c show the writing, erasing and reading of the disclosed multi-bit split-gate flash memory cell.
[0049]FIGS. 4a-4f show top views of a portion of a substrate while FIGS. 5a-5f show the cross-sectional views taken at corresponding locations shown on the top views. Thus, in FIG. 4a, top view of a portion of substrate (100) is shown. The substrate is preferably a single-crystal silicon doped with a first conductive type dopant, for example, boron (B). The substrate is provided with a plurality of active and passive field regions, as is known in the art, and are referenced as (103) and (105), respectively. The active regions define cells which are implanted to a threshol...
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