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Substrate processing apparatus, substrate processing method, and computer program

a substrate processing and substrate technology, applied in the direction of liquid surface applicators, coatings, chemical vapor deposition coatings, etc., can solve the problems of dangerous necessity for the operator to insert his or her hand and head, and the efficiency of producing substrates is significantly reduced, so as to improve the efficiency of producing substrates in the substrate processing apparatus.

Inactive Publication Date: 2006-01-19
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is a substrate processing apparatus that can collect unrecognized substrates, such as "ghost wafers," without interrupting the processing of other substrates. The apparatus includes a carry-in / out section, a processing section, a substrate carrier means, and a control unit that manages each substrate individually. The control unit can control the carriage of the substrates using the substrate carrier means and can collect unrecognized substrates by carrying them to the carry-in / out section. This improves the efficiency of producing substrates in the substrate processing apparatus.

Problems solved by technology

The substrate processing is suspended every time the “ghost wafer” occurs and removal work of the “ghost wafer” is performed as described above, causing a significant decrease in the efficiency of producing substrates.
In addition, there is a dangerous necessity for the operator to insert his or her hand and head into the apparatus to remove the “ghost wafer” by hand.

Method used

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  • Substrate processing apparatus, substrate processing method, and computer program
  • Substrate processing apparatus, substrate processing method, and computer program
  • Substrate processing apparatus, substrate processing method, and computer program

Examples

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Embodiment Construction

[0026] Hereinafter, a preferred embodiment of the present invention will be described. FIG. 1 is a plan view showing the outline of a configuration of a coating and developing treatment apparatus 1 as a substrate processing apparatus according to this embodiment, FIG. 2 is a front view of the coating and developing treatment apparatus 1, and FIG. 3 is a rear view of the coating and developing treatment apparatus 1.

[0027] The coating and developing treatment apparatus 1 has, as shown in FIG. 1, a configuration, in a casing 1a as a housing covering the entire apparatus, for example, a cassette station 2 as a carry-in / out section for carrying, for example, 25 wafers per cassette from / to the outside into / from the coating and developing treatment apparatus 1 and carrying the wafers into / out of the cassette C, a processing station 3 as a processing section including various kinds of processing and treatment units, which are multi-tiered, for performing predetermined processing or treatme...

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Abstract

In the present invention, when a ghost wafer which is not recognized by a control unit on a coating and developing treatment apparatus side is carried out of another apparatus which is connected to the coating and developing treatment apparatus, the ghost wafer is temporarily housed in a buffer cassette on the coating and developing treatment apparatus side. The ghost wafer in the buffer cassette is then collected into a carry-in / out section on the coating and developing treatment apparatus side through use of a carrier unit at a timing which does not affect processing of other wafers According to the present invention, the ghost wafer occurred in the coating and developing treatment apparatus can be collected without suspension of processing of other ordinary substrates.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus, a substrate processing method, and a computer program. [0003] 2. Description of the Related Art [0004] Photolithography process in a manufacturing process of, for example, a semiconductor device is usually performed using a coating and developing treatment apparatus. The coating and developing treatment apparatus includes a carry-in / out section for carrying substrates from / to the outside, a processing section including a plurality of processing and treatment units for performing various kinds of processing or treatments such as a resist coating treatment, a developing treatment, thermal processing and so on, and an interface section for transferring the substrates between the processing section and an aligner being another apparatus. The coating and developing treatment apparatus further includes a plurality of carrier units for carrying the substrat...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C23F1/00
CPCH01L21/67253H01L21/68
Inventor HIGASHI, MAKIOMIYATASEKI, SHINICHI
Owner TOKYO ELECTRON LTD
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