Spray slurry delivery system for polish performance improvement and cost reduction
a technology of slurry and polishing surface, which is applied in the direction of grinding machine components, manufacturing tools, lapping machines, etc., can solve the problems of distorting the features and uneven polishing of the polishing surfa
Inactive Publication Date: 2006-02-02
APPLIED MATERIALS INC
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Benefits of technology
[0011] In another aspect, an apparatus is provided for delivering a polishing fluid to a chemical mechanical polishing surface including a delivery arm, two or more nozzles disposed on a delivery portion of the delivery arm with each nozzle adapted to disperse the polishing fluid with an adjustable droplet s
Problems solved by technology
One of the challenges in developing robust polishing systems and processes is providing uniform material removal across the polished surface of the substrate.
An additional problem with polishing uniformity is the distribution of slurry on the polishing surface.
If the slurry is unevenly distributed, the polishing surface may not evenly polish across the substrate surface.
If too little slurry is used, the polishing surface may distort the features of the substrate surface.
If too much slurry is applied, valuable slurry may be wasted.
Method used
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Embodiment Construction
[0018] The present invention provides a slurry delivery method and apparatus for polishing a substrate in a chemical mechanical polishing system. In one aspect, the invention provides a slurry delivery method and apparatus that utilizes a plurality of nozzles that may be configured to dispense droplets with adjustable size and adjustable droplet stream path angles.
[0019] Examples of polishing systems which may be adapted to benefit from aspects of the invention are disclosed in U.S. Pat. No. 6,244,935 issued Jun. 12, 2001 by Birang, et al. and U.S. Pat. No. 5,738,574 issued Apr. 14, 1998 to Tolles, et al., both of which are incorporated by reference in their entirety.
[0020]FIG. 1 depicts one embodiment of a polishing system 100 for polishing a substrate 112 having a polishing fluid delivery system 102 that controls the distribution of polishing fluid 114 across a polishing material 108. Although the polishing fluid delivery system 102 is described in reference to the illustrative ...
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Methods and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one aspect, the apparatus comprises a vertical arm having a delivery portion located proximate to a circumference of a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size, and at least a second nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a second adjustable droplet size. In another aspect of the invention, the apparatus comprises a horizontal arm having a delivery portion disposed at least partially over a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size across a first region of the polishing surface, and at least a second nozzle disposed horizontally spaced from the first nozzle on the delivery portion, and adapted to dispense the polishing fluid with a second adjustable droplet size across a second region of the polishing surface.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims benefit of U.S. provisional patent application Ser. No. 60 / 592,669, filed Jul. 30, 2004, which is herein incorporated by reference.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] Embodiments of the present invention generally relate to a slurry delivery method and apparatus for polishing a substrate in a chemical mechanical polishing system. [0004] 2. Description of the Related Art [0005] Chemical mechanical planarization, or chemical mechanical polishing (CMP), is a common technique used to planarize substrates. Chemical mechanical planarization systems generally utilize a polishing head to retain and press a substrate against a polishing surface of a polishing material while providing motion therebetween. In conventional CMP techniques, a substrate carrier or polishing head is mounted on a carrier assembly and positioned in contact with a polishing article in a CMP apparatus. The carrier ass...
Claims
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Login to View More IPC IPC(8): B24B51/00
CPCB24B57/02B24B37/04
Inventor SUN, LIZHONGZHU, LEILAM, GARY KA HOJACKSON, ROBERT L.HSU, WEI-YUNG
Owner APPLIED MATERIALS INC