Method and system for calibrating a laser processing system and laser marking system utilizing same

a laser processing system and laser marking technology, applied in the field of method and system for calibrating a laser processing system and laser marking system utilizing same, can solve problems such as poor mark quality or mark positioning errors
US20060054608A1Inactive Publication Date: 2006-03-16ELECTRO SCI IND INC
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
ELECTRO SCI IND INC
Publication Date
2006-03-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method of calibrating a laser marking system includes calibrating a laser marking system in three dimensions. The step of calibrating includes storing data corresponding to a plurality of heights. A position measurement of a workpiece is obtained to be marked. Stored calibration data is associated with the position measurement. A method and system for calibrating a laser processing or marking system is provided. The method includes: calibrating a laser marker over a marking field; obtaining a position measurement of a workpiece to be marked; associating stored calibration data with the position measurement; relatively positioning a marking beam and the workpiece based on at least the associated calibration data; and calibrating a laser marking system in at least three degrees of freedom. The step of calibrating includes storing data corresponding to a plurality of positions and controllably and relatively positioning a marking beam based on the stored data corresponding to the plurality of positions.
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Description

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application is a continuation of U.S. application Ser. No. 10 / 438,533, filed May 15, 2003 entitled “Method And System For Calibrating A Laser Processing System And Laser Marking System Utilizing Same.” This application also claims the benefit of U.S. provisional application Ser. No. 60 / 381,602, filed May 17, 2002 entitled “Precision Laser Marking Method And System.”BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The invention relates to calibration of laser-based workpiece micromachining and similar material processing systems, wherein the workpiece has considerable warpage or sag. The workpiece may be a semiconductor wafer, for instance a 300 mm wafer, with a thickness of a few hundred microns.

[0004] 2. Background Art

[0005] The following representative patent references relate to various aspects of laser marking of wafers and electronic assemblies, illumination, and inspection / reading marks: U.S. Pat. Nos. 4,5...

Claims

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