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Method and system for calibrating a laser processing system and laser marking system utilizing same

a laser processing system and laser marking technology, applied in the field of method and system for calibrating a laser processing system and laser marking system utilizing same, can solve problems such as poor mark quality or mark positioning errors

Inactive Publication Date: 2006-03-16
ELECTRO SCI IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an improved method and system for calibrating a laser processing system and laser marking system. The method involves calibrating a marker system in three dimensions by storing data at multiple heights and obtaining position measurements of a workpiece. The system includes a calibrated galvanometer marking head, calibrated positioning stage, calibrated alignment camera, and controller for coordinating the positioning of the marker system relative to the workpiece. The system also includes a laser based marking system with a calibrated optical measurement system for accurately positioning the workpiece. The technical effects of the invention include improved accuracy and efficiency in laser processing and marking.

Problems solved by technology

Tolerance stackups within the system and workpiece may lead to poor mark quality or mark positioning errors.

Method used

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  • Method and system for calibrating a laser processing system and laser marking system utilizing same

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Overview

[0060] Several components of a system 100 for laser marking and inspection of wafers, for instance 300 mm wafers, is schematically illustrated in FIG. 5A. A robot 101 transfers a wafer from a FOUP (Front Opening Unified Portal) delivery device to a pre-aligner 102 which is used to find the notch or flat of the wafer so as to orient the wafer for further processing. Reader 103 may be used to extract certain coded information which in turn may be used in subsequent processing steps. A precision stage 104 is used, and a fine alignment procedure included to correct the residual error of the pre-aligner (e.g., X, Y, rotation). The wafer is marked. All marks, or a designated subset, are then inspected. In the arrangement of FIG. 5A the inspection system is used with a separate inspection stage 105.

[0061] A marking sequence, following opening of a FOUP, includes: [0062] 1. Robot moves the wafer to the pre-aligner and establishes a notch-die positional relation. [0063] 2. The waf...

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Abstract

A method of calibrating a laser marking system includes calibrating a laser marking system in three dimensions. The step of calibrating includes storing data corresponding to a plurality of heights. A position measurement of a workpiece is obtained to be marked. Stored calibration data is associated with the position measurement. A method and system for calibrating a laser processing or marking system is provided. The method includes: calibrating a laser marker over a marking field; obtaining a position measurement of a workpiece to be marked; associating stored calibration data with the position measurement; relatively positioning a marking beam and the workpiece based on at least the associated calibration data; and calibrating a laser marking system in at least three degrees of freedom. The step of calibrating includes storing data corresponding to a plurality of positions and controllably and relatively positioning a marking beam based on the stored data corresponding to the plurality of positions.

Description

CROSS-REFERENCE TO RELATED APPLICATION [0001] This application is a continuation of U.S. application Ser. No. 10 / 438,533, filed May 15, 2003 entitled “Method And System For Calibrating A Laser Processing System And Laser Marking System Utilizing Same.” This application also claims the benefit of U.S. provisional application Ser. No. 60 / 381,602, filed May 17, 2002 entitled “Precision Laser Marking Method And System.”BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The invention relates to calibration of laser-based workpiece micromachining and similar material processing systems, wherein the workpiece has considerable warpage or sag. The workpiece may be a semiconductor wafer, for instance a 300 mm wafer, with a thickness of a few hundred microns. [0004] 2. Background Art [0005] The following representative patent references relate to various aspects of laser marking of wafers and electronic assemblies, illumination, and inspection / reading marks: U.S. Pat. Nos. 4,5...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B23K26/02B23K26/00B23K26/03B23K26/04B23K26/08B23K26/36B41M5/24G06K1/12H01C17/242H01L21/00H01L21/02H01L21/68H01L23/544
CPCB23K26/04B23K26/043B23K26/0853B23K26/365B23K26/4075B23K2201/007B23K2201/40G06K1/126H01C17/242H01L21/67282H01L21/681H01L23/544H01L2223/5442H01L2223/54453H01L2223/54473H01L2223/5448B23K26/426B23K26/041B23K26/40B23K26/042B23K26/361B23K26/705B23K2101/007B23K2101/40B23K2103/50H01L2924/0002H01L2924/00B23K26/02
Inventor CAHILL, STEVEN P.EHRMANN, JONATHAN S.LI, YOU C.SCHRAMM, RAINERPELSUE, KURT
Owner ELECTRO SCI IND INC
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