Dicing tape attaching unit that can attach pre-cut dicing tape and general dicing tape to wafer and in-line system having the dicing tape attaching unit

Abstract

A dicing tape attaching unit that can attach both a pre-cut dicing tape and a general dicing tape to a wafer in a semiconductor package assembling process, and an in-line system used in a semiconductor package process including the dicing tape attaching unit are provided. The dicing tape attaching unit supplies one of the pre-cut dicing tape and the general dicing tape and attaches it to a wafer according to the direction of rotation of a tape loader. Accordingly, without an additional pre-cut dicing tape attaching unit, either of the pre-cut dicing tape and the general dicing tape can be attached to the back side of the wafer by one and the same unit.

Description

[0001] This application is a Divisional of U.S. patent application Ser. No. 10 / 607,600, filed Jun. 27, 2003, now pending, which claims priority from Korean Patent Application No. 2002-0040846, filed on Jul. 12, 2002, which is incorporated by reference in its entirety. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to the field of a semiconductor package assembly, and more particularly, to a dicing tape attaching unit, and to an in-line system including the dicing tape attaching unit. [0004] 2. Description of the Related Art [0005] Numerous semiconductor chips can be formed from a semiconductor wafer manufactured in a wafer manufacturing process. When a wafer is diced, the semiconductor chips are created. However, these individual semiconductor chips are incomplete and not able to function unless they have external connection terminals, such as solder balls or leads. These external connection terminals can be easily damaged by shock ...

AI Technical Summary

Benefits of technology

The present invention provides an in-line system for assembling semiconductor packages, which uses both a pre-cut dicing tape and a general dicing tape in a single unit. This system allows for efficient and effective attachment of the dicing tape to the wafer after grinding. The system also includes a dicing tape attaching unit that uses a tape loader to supply the dicing tape and a liner film winding reel to wind the dicing tape. The system also includes a tape cutter to remove any remaining general dicing tape. The invention provides a more efficient and cost-effective way to assemble semiconductor packages.

Problems solved by technology

However, these individual semiconductor chips are incomplete and not able to function unless they have external connection terminals, such as solder balls or leads.

These external connection terminals can be easily damaged by shock or impact.

The wafer after grinding is easily damaged by external shock, and sometimes tends to warp.

Thus, there is often difficulty when the wafer is transferred to an assembling unit of a semiconductor package process, or when the wafer is handled in the assembling unit.

In the case of using liquid epoxy, the semiconductor chip is very thin, and exhibits a die tilt defect.

Also, a dicing tape attaching unit that can attach only a pre-cut dicing tape to a wafer does not perform a wafer back side grinding function, and is used only in an independent process of only attaching the dicing tape to the wafer.

First, more assembling units are required, so manufacturing costs increase.

Second, more assembling units are required, so the space occupied by a semiconductor package assembling line increases.

Third, when a wafer made thin by performing a wafer back side grinding process is transferred by an assembling unit, warping of the wafer occurs and there is danger of fracturing the thin wafer.

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