Method and Device for Producing a System Having a Component Applied to a Predetermined Location of a Surface of a Substrate

Abstract

A method for producing a system with a substrate with a surface and a component applied to a predetermined location of the surface of the substrate includes a step of generating a liquid volume containing the component and a step of applying the liquid volume containing the component on the surface of the substrate. At that, the liquid volume is sized so that it wets only a partial area of the surface of the substrate after its application. In the step of applying the liquid volume is placed on the surface of the substrate so that the partial area of the surface includes the predetermined location. The component or the predetermined location of the surface of the substrate is implemented so that after the application of the liquid volume a force acts on the component which is sufficient to drive the component within the liquid volume to the predetermined location. The method is completely independent of the speed of a gripper and its capability to grip and align a very small component.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional of U.S. application Ser. No. 10 / 861,289, filed Jun. 4, 2004, and is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a method and a device for producing a system having a substrate with a surface and a component applied to a predetermined location of the surface of the substrate, in particular to a micro-electronic or micro-mechanical component. [0004] 2. Description of the Related Art [0005] Conventionally, electronic, microelectronic or micromechanical components or members, respectively, are applied in the so called pick-and-place-method to boards, semiconductor and other substrates or a package or a mounting unit, respectively. Hereby, components are provided on different carrier systems, for example bands. A gripper grabs or grips each individual component, moves it from the carrier system to the sub...

AI Technical Summary

Benefits of technology

[0012] In particular using an inkjet print method, very small droplets of the liquid medium may be placed on a substrate very accurately in place and at the same time very fast and at very low costs. An important advantage of the present invention therefore is that it neither depends on the speed of a gripper nor on its capability to grip and align a very small component. The present invention rather uses the extremely high throughput in comparison to a gripper, using which liquid volumes may be applied to a substrate for example using the mentioned inkjet printing method. Further, the present invention uses the high precision which may at the same time be achieved here. In this connection, the printing speed and the revolution are noted which are achieved by modern inkjet printers. Thereby, a liquid volume may be placed on a surface of a substrate so that the (very small) wetted partial area of the surface includes the predetermined location in which the component is to be applied onto the substrate.

[0013] Further, the present invention is based on the idea to use special surface structures on the component or the microchip or the substrate, respectively, to cause a lateral self adjustment and preferably simultaneously an alignment of the component relative to the substrate preferably in cooperation with the liquid medium.

[0014] More generally, according to the present invention the component or the predetermined location of the surface of the substrate to which the component is to be applied are implemented so that after the application of the liquid volume a force acts on the component which is sufficient to drive or move, respectively, the component within the liquid volume to the predetermined location by itself or for example together with a Brownian movement of the same.

[0015] As, according to the present invention, a preferably very small liquid volume is preferably applied very accurately to the location to which the component is to be applied on the surface of the substrate or where it later has to fulfill its function, respectively, the component will reach the predetermined location from the outside very fast and without further ado. In other words, according to the present invention, in contrast to a pure self assembly method in which the whole substrate is immersed into a liquid containing the component, a large part of the probability process of the approximation of the component to the predetermined location is prevented or shortened, respectively. Such a probability process would for example be an arbitrary movement of the component which would have to be supported by a flow, by leading through a gas, or by ultrasonics for large liquid volumes. According to the present invention, only the final adjustment of the component at the predetermined location on the surface of the substrate is performed within the liquid droplet.

[0016] According to a preferred embodiment of the present invention, the surface structures include hydrophilic and hydrophobic or lipophobic and lipophilic layers or sections, respectively, or layers or portions, respectively, with complementary macromolecule pairs, for example DANN, wherein the layers or portions, respectively, are arranged in suitable graphical patterns.

[0017] According to a further preferred embodiment of the present invention, the liquid volume includes a quickly or very quickly volatile liquid, respectively, or such as a medium, respectively. This is in particular the case when the alignment and attachment of the component to the predetermined location on the surface of the substrate is not to be performed by the liquid forces but for example by mechanical, electrostatical or other effects. Preferably, when drying the liquid, electrical contacts or pre-stages of contacts result which may be processed further. Further, the component is preferably fixed on the substrate when drying the liquid.

Problems solved by technology

The described processes or method steps and thus the loading of a substrate with components using a pick-and-place-method is therefore generally very time-intensive.

Therefore, only a limited throughput may be achieved in production.

In particular, for high-volume product categories or product categories with large production volumes, respectively, the conventional loading or assembling, respectively, therefore represents an obstacle for an increase of the production volume which may not be overcome.

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