Electronic component mounting apparatus
Patent Information
- Authority / Receiving Office
- US ยท United States
- Current Assignee / Owner
- HITACHI HIGH TECH INSTR CO LTD
- Publication Date
- 2007-01-18
- Estimated Expiration
- Not applicable ยท inactive patent
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Abstract
Description
CROSS-REFERENCE OF THE INVENTION
[0001] This application is based on Japanese Patent Applications No. No. 2005-192116, the content of which is incorporated herein by reference in its entirety. BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to an electronic component mounting apparatus having a plurality of component feeding units aligned on a feeder base, the component feeding unit feeding an electronic component stored in a storage tape to a component pickup position, in which a suction nozzle picks the electronic component fed by the component feeding unit and mounts the electronic component on a printed board.
[0004] 2. Description of the Related Art
[0005] In this kind of electronic component mounting apparatus, particularly in a high-speed gantry-type mounting device, since the component feeding units are fixed and not moved, there are rapidly increasing users employing the so-called splicing where storage tapes are connected to each o...