Flat plate heat transfer device

Abstract

Disclosed is a flat plate heat transfer device, which includes a thermal-conductive flat case installed between a heat source and a heat emitting unit and containing a working fluid which is evaporated with absorbing heat from the heat source and is condensed with emitting heat to the heat emitting unit; and one layer of mesh installed in the flat case and configured so that wires are woven to be alternately crossed up and down. A dispersion channel of a vapor is formed along a surface of the wire from a cross point of the mesh near the heat source, and a flow channel of a liquid is formed by means of a capillary phenomenon along a length direction of the wire from a mesh lattice near the heat emitting unit to a mesh lattice near the heat source.

Description

TECHNICAL FIELD [0001] The present invention relates to a flat plate heat transfer device capable of transferring heat by means of a working fluid circulating mechanism using evaporation and condensation without applying a separate mechanical energy, and more particularly to an improved flat plate heat transfer device capable of having a thinner structure and preventing transformation caused by an external impact. BACKGROUND ART [0002] In recent, an electronic equipment such as notebook or PDA becomes smaller and thinner along with the development of integration technique. In addition, together with the increased demands for high response of an electronic equipment and improvement of functions, energy consumption is also tending increased. Accordingly, much heat is generated from electronic parts in the electronic equipment while the equipment is operated, so various flat plate heat transfer devices are used to emit the heat outside. [0003] A traditional example of the conventional ...

AI Technical Summary

Benefits of technology

[0010] The present invention is designed to solve the problems of the prior art, and therefore it is an object of the present invention to provide a flat plate heat transfer device with an improved inner structure, which is capable of becoming thinner with keeping the heat transfer mechanism using evaporation and condensation of a working fluid as it was, and preventing the device from being transformed by an impact possibly applied while the device is manufactured or handled.

Problems solved by technology

In addition, together with the increased demands for high response of an electronic equipment and improvement of functions, energy consumption is also tending increased.

If there is no sufficient space for the working fluid to be dispersed from the evaporating part to the condensing part, the heat transfer mechanism using evaporation and condensation of the working fluid may be not appropriately realized, thereby deteriorating the performance of the heat transfer device.

However, since the conventional flat plate heat transfer device 10 keeps its inside vacuous (or, decompressed) and does not adopt a mechanical structure capable of enduring an external impact, the metal case 50 is apt to be crushed by a trivial impact while the device is manufactured or handled, which resultantly transforms a vapor dispersion channel, thereby deteriorating a heat transfer characteristic of the product.

Accordingly, the conventional flat plate heat transfer device 10 has a limitation in satisfying the current demands for a thinner structure.

Images