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Low viscosity precursor compositions and methods for the deposition of conductive electronic features

a technology of electronic features and precursor compositions, applied in the field of precursor compositions, can solve the problems of inadequate approaches to produce well-defined features with good electrical properties, low viscosity of formulations, and inability to use alternative deposition methods

Inactive Publication Date: 2007-05-10
CABOT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to precursor compositions and methods for depositing conductive electronic features on various substrates. The invention aims to provide low viscosity precursor compositions with low processing temperatures that can be deposited using ink-jet printing or other direct-write tools. The precursor compositions should ideally have good electrical and mechanical properties, and should be able to form conductive features with low conversion temperatures. The ideal method should allow for the deposition of fine feature sizes and should be applicable to a variety of substrates.

Problems solved by technology

However, this latter family of low viscosity compositions is not as well developed as the high viscosity compositions.
Ink-jet printing of conductors has been explored, but the approaches to date have been inadequate for producing well-defined features with good electrical properties.
However, the formulations have a relatively high viscosity and are not useful for alternative deposition methods such as ink-jet printing.
However, the deposits were chosen for optical properties and were either not conductive or were poorly conductive.
However, the printing of these compositions is not disclosed in detail.
However, formulations for depositing electronic features are not disclosed.

Method used

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  • Low viscosity precursor compositions and methods for the deposition of conductive electronic features
  • Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Examples

Experimental program
Comparison scheme
Effect test

example 1

Comparative Example

[0321] A silver metal precursor composition containing 50 grams Ag-trifluoroacetate and 50 grams H2O was formulated. The calculated silver content of the precursor composition was 24.4 wt. % and thermogravimetric analysis showed the mass loss reached 78 wt. % at 340° C. This data corresponds to the above-described decomposition temperature for pure Ag-trifluoroacetate, within a reasonable margin for error.

example 2

Preferred Additive

[0322] A silver precursor composition was formulated containing 44 grams Ag-trifluoroacetate, 22 grams H2O, 33 grams DEGBE and 1 gram lactic acid. The calculated silver content was 21.5 wt. % and thermogravimetric analysis showed the mass loss reached 79 wt. % at 215 EC. The addition of DEGBE as a conversion reaction inducing agent advantageously reduced the conversion temperature by 125 EC compared to the formulation described in Example 1, a decrease of about 34 percent compared to pure Ag-trifluoracetate. The lactic acid functions as a crystallization inhibitor.

example 3

Comparative Example

[0323] A silver precursor composition was formulated containing 58 grams Ag-trifluoroacetate and 42 grams dimethylformamide. The calculated silver content was 21.5 wt. % and thermogravimetric analysis showed a mass loss of 78.5 wt. % at 335 EC, a conversion temperature similar to the formulation in Example 1. This example illustrates that a common solvent (dimethylformamide) had no affect on the conversion temperature of the composition.

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Abstract

A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation application of co-pending U.S. patent application Ser. No. 10 / 265,351, filed Oct. 4, 2002, which claims the benefit of U.S. Provisional Application No. 60 / 327,620 filed Oct. 5, 2001. Each of the foregoing referenced patent applications is incorporated by reference herein as if set forth below in its entirety.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to precursor compositions that are useful for the deposition of conductive electronic features. The precursor compositions can advantageously have a low conversion temperature to enable low-temperature treatment of the precursors to form conductive electronic features on a variety of substrates. The precursor compositions can also have a low viscosity to enable the deposition of the compositions using direct-write tools, such as ink-jet devices. [0004] 2. Description of Related Art [0005] The electroni...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01B1/12C23C18/06C23C18/08H01B1/02H05K3/10
CPCC23C18/06C23C18/08H01B1/026H05K3/105H01L24/03H01L24/05H01L2224/05294H01L2224/053H01L2924/12042H01L2924/12044H01L2924/14H05K1/097H05K2201/0154H05K2203/1131H01L2924/00
Inventor KODAS, TOIVO T.HAMPDEN-SMITH, MARK J.VANHEUSDEN, KARELDENHAM, HUGHSTUMP, AARON D.SCHULT, ALLEN B.ATANASSOVA, PAOLINAKUNZE, KLAUS
Owner CABOT CORP
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