System and method for electroplating flexible substrates

Abstract

A processing system for processing flexible substrates is disclosed. The system includes a loading station having an input spool adapted to support a wounded, unprocessed flexible substrate; a processing station adapted to perform one or more predetermined processes on the flexible substrate; an unloading station having an output spool adapted to receive the processed flexible substrate; and a substrate stability subsystem adapted to maintain the flexible substrate in a substantially vertical orientation while the substrate undergoes the one or more processes performed by the processing station. The substrate stability subsystem includes movable upper clips adapted to engage with upper portions of the flexible substrate, and a plurality of lower clips adapted to engage with lower portions of the flexible substrate as it is being transported into and out of the processing station. Also disclosed is a unique shield for the cathode clips to improve the uniformity of the deposition formed on the flexible substrate, and a unique seal to allow the transportation of the lower clips into and out of the electroplating cell while reducing leakage of fluid from the cell.

Description

FIELD OF THE INVENTION [0001] This invention relates generally to electroplating systems, and in particular, to a system and method for electroplating flexible substrates. BACKGROUND OF THE INVENTION [0002] The electroplating of a flexible substrate typically involves a two step process. First, an electrically-conductive seed layer is formed on the flexible substrate. Typically, this is accomplished by subjecting the substrate to a vacuum sputtering process to form a thin layer of metallization on the substrate (typically referred to as a “seed layer”). For example, a copper seed layer having a thickness between 500 and 2000 Angstroms may be formed on a polyimide or polyethylene substrate. The seed layer serves as an electrically-conductive layer on which further deposition may be formed by a subsequent electroplating process. [0003] Second, the flexible substrate having the seed layer thereon is subjected to an electroplating process to increase the thickness of the metallization l...

AI Technical Summary

Benefits of technology

[0011] A processing system for processing flexible substrates or other types of articles is disclosed. The system includes a loading station having an input spool adapted to provide an unprocessed flexible substrate; a processing station adapted to perform one or more predetermined processes on the flexible substrate; an unloading station having an output spool adapted to receive the processed flexible substrate; and a substrate stability subsystem adapted to maintain the flexible substrate in a substantially stable vertical orientation while the substrate undergoes the one or more processes performed by the processing station. The substrate stability subsystem includes a plurality of movable upper clips adapted to engage with respective upper portions of the flexible substrate, and a plurality of movable lower clips adapted to engage with respective lower portions of the flexible substrate as it is being transported into and out of the processing station. Also disclosed is a unique shield for the cathode clips to improve the uniformity of the deposition formed on the flexible substrate, and a unique seal to allow the transportation of the lower clips into and out of a processing cell while reducing leakage of fluid from the cell.

Problems solved by technology

FIG. 1D illustrates a side view of the conventional electroplating cell 106 including another abnormally situated flexible substrate S. Another problem associated with thin flexible substrates is that the bottom portion of the substrate tends to float.

The large number of cathode contact rollers making contact to the substrate typically causes considerable damage to the material.

Images