Liquid cooling system with thermoeletric cooling module

Abstract

A liquid cooling system has a thermoelectric cooling module, a heat dissipating assembly, a water block and multiple flexible guide tubes with liquid flows inside. The thermoelectric cooling module has a cold surface and a hot surface. The water block has a contacting surface attached to a processor of a computer. The guide tubes are mounted between the thermoelectric cooling module, the heat dissipating assembly and the water block. With the thermoelectric cooling module, the liquid cooling system can cool a processor of computer hardware with high efficiency, and is able to dissipate extraordinary heat generated by the processor.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a cooling system, and more particularly to a liquid cooling system with thermoelectric cooling module that can cool a processor of a computer more efficiently, and dissipate much more of extraordinary heat generated by the processor[0003]2. Description of Related Art[0004]Since computer hardware is developed rapidly and provides high performance, as a result, there is a significant problem of computer processor overheating.[0005]The most common solution for cooling a working computer processor is to use a heat dissipating fan or a heat dissipating fin assembly to take away heat generated by the computer processor. Mostly, the heat dissipating fan or heat dissipating fin assembly is mounted securely in a case of the computer hardware and has air or water as coolant to flow through and to absorb heat.[0006]However, as the function of the computer hardware becomes more efficient, more heat ...

AI Technical Summary

Benefits of technology

[0014]With such an arrangement, heat generated by the processor is quickly absorbed by the liquid. Then, the liquid takes heat away from the processor to the heat dissipating assembly for dissipation. Additionally, when the liquid pass through the hot surface, the liquid absorbs the heat of the hot surface transferred from the cold surface so as to reduce the temperature of the hot surface and to prevent the thermoelectric cooling module from burning.

[0016]Otherwise, because the guide tubes are flexible, the components of the liquid cooling system can be mounted in the case at will, such that the liquid cooling system in accordance with the present invention provides more convenience to use.

Problems solved by technology

Since computer hardware is developed rapidly and provides high performance, as a result, there is a significant problem of computer processor overheating.

Current solutions based on passive fan or fin assembly are only just able to cope with the heat generated by the conventional computer and may unable to dissipate extraordinary heat generated by the processor of the modern computer.

Furthermore, the components of the conventional heat dissipating fan or heat dissipating fin assembly are connected by rigid tubes, such that if the computer cases having electronic elements in different positions, the heat dissipating fan or heat dissipating fin assembly may be troublesome to mount in the cases.

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