Solid-state imaging device, fabrication method of the same, and camera module

Abstract

There is provided a solid-state imaging device including: a semiconductor package support mounting a solid-state image sensor; bonding wires electrically connecting first terminals formed on the solid-state image sensor and second terminals formed on the semiconductor package support; a sealing member sealing at least the second terminals to which the bonding wires are connected; and an optically-transparent member made of an optically-transparent material and disposed above the solid-state image sensor, in which the optically-transparent member is supported by different support members formed on the semiconductor package support at three or more positions not on a single straight line.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS [0001] The present invention contains subject matter related to Japanese Patent Application JP 2005-356354 filed in the Japanese Patent Office on Dec. 9, 2005, the entire contents of which being incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a solid-state imaging device, a fabrication method thereof, and a camera module. More particularly, the present invention relates to a solid-state imaging device using a semiconductor package support mounting a solid-state image sensor, a fabrication method and a camera module. [0004] 2. Description of Related Art [0005] Recently, it is required for a solid-state imaging camera module using a CCD imager or a CMOS imager to be mounted, as a camera system including a signal processing unit, on a mobile terminal such as mobile phones and personal digital assistance (PDA). [0006] A related art solid-state imaging camera mo...

AI Technical Summary

Benefits of technology

[0019] Since the optically-transparent member is supported by the different support members formed on the semiconductor package support at three or more positions not on a single straight line, it is not necessary to support the optically-transparent member only by the sealing member before curing. It is therefore possible to retain a levelness of the optically-transparent member even if it is disposed before the sealing member is cured.

[0022] By sealing not only the second terminals but also the first terminals with the sealing member, it is possible to reduce moisture permeation into the connection regions between the terminals and bonding wires, and to suppress corrosion and improve the product quality. Further, since all the first and second terminals and bonding wires are sealed with the sealing member, it is possible to suppress corrosion of the bonding wires themselves so that a further improved product quality can be expected.

[0027] Since the optically-transparent member is supported by the different support members formed on the semiconductor package support at three or more positions not on a single straight line, it is not necessary to support the optically-transparent member by the sealing member before curing. It is therefore possible to retain a levelness of the optically-transparent member.

Problems solved by technology

With the above-described solid-state imaging device, it is however difficult to retain a levelness of the seal glass mounted on the upper surface of the sealing member of resin material or the like.

However, in this case, when the seal glass is disposed on the resin material, the resin material is still not cured so that the seal glass is disposed on the resin material in a non-cured state (in a soft state), causing it difficult to retain a levelness of the seal glass.

It is therefore not always proper to adopt this method of curing the resin material and mounting the seal glass on the cured resin material.

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