Trayconcept

Abstract

A packaging arrangement (100, 200) for storing at least one component (105, 205), comprising at least one tray (101, 102, 103, 104, 203, 204) being adapted to hold and set the component and to provide individual mechanical protection for at least parts of the component.

Description

TECHNICAL FIELD [0001] The present invention relates to a packaging arrangement for storing components and comprising at least one tray according to the preamble of claim 1, and a collapsible packaging system according to claim 16 utilizing the packaging arrangement. DESCRIPTION OF PRIOR ART [0002] Packaging systems comprising trays for holding and securing and / or setting / aligning various components or items packed together in layers have been known in a number of variants, e.g. in the electronic field. [0003] A pallet for transport of items in the form of bobbins is disclosed in U.S. Pat. No. 4,580,680. The pallet comprises a bottom part and a cover / lid part, the parts having corresponding configurations. Several pallets filled with items may be superimposed, i.e. placed on each other in stacks and stacks, wherein the components are load carrying. The sides of the bottom part and the lid part facing the components are provided with projections to be received by recesses in the comp...

AI Technical Summary

Benefits of technology

[0008] By the improved packaging system and arrangement of the invention and preferred embodiments of the invention, several advantages are obtained. Each of the stored components is at least partly provided with an individual mechanical protection enhancing the securing and holding of the components in place and the repeatability when handled. Both manual and automated handling of the components is simplified since the tray / -s set, hold, stay, and / or orientate the components making the packaging system and arrangement very user-friendly. The rejection rate of valuable components that often are sensitive to static electricity and easily damaged may be eliminated or at least decreased since one embodiment of the system and arrangement may protect against electrical impulses. Access to the components on the tray / -s placed accessible at the top of a tray or a stack of trays is also improved since at least one of the tray embodiments do not have high sides obstructing access. The trays in one embodiment relieve loads / forces / impacts from the components and protect them against damages. The components are also securely held and positioned. This also eliminates the risk of damages on the components due to the physical proximity of other components or wrapping material, equipment for handling, or gripping appliances, even if handled carelessly.

[0009] The packaging system and arrangement according to the invention enable an extraordinarily effective transport system with a high efficiency in use of available volume, i.e. the system maximizes the packaging density when erected and filled with items and also when the system is emptied / cleared of items and empty, and collapsed system units are returned, and minimizes the required amount of packaging material, the weight, and costs for packaging material.

[0010] Another advantage is that one packaging system and arrangement embodiment use nestable trays that further improve the resource efficiency in terms of used volume and life cycle. Hence, the stackable and / or nestable trays are space-saving when storing and / or returning empty trays requiring even less storage and transport space.

[0011] Moreover, the packaging system and arrangement eliminate / limit the development of dust and any dirtying / soiling of the components and the associated area where the components are loaded / unloaded.

Problems solved by technology

They do not provide a sufficient mechanical protection for the packed / wrapped items.

Moreover, prior art packaging systems are also cumbersome and heavy to handle after unloading of items requiring a lot of space during packing, transport, unloading, and returning them as returnable empties, thereby requiring too much resources in terms of volume and life cycle.

The recycling of prior art packaging systems is also very complicated because the pallets, the lid, and the side walls often are made of different materials requiring different handling methods and different ways of recycling.

These materials are also non-conductive, which is a great disadvantage, especially for electronic components.

These types of materials are also very easy to damage creating debris and / or dust during handling, and are also sensitive for moisture or water, i.e. they are often permeable for water, whereby any stored items and the packaging system itself may be water-damaged, or even destroyed.

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