Method for carrying a semiconductor device
a semiconductor device and carrying device technology, applied in the direction of total factory control, program control, and preventing decay of containers, can solve the problems of troublesome sorting work for re-use of receptacles, serious problems such as paper label generation, paper powder, adhesive and ink produced in dustproof bags, etc., to achieve clean mounting of semiconductor devices, convenient carrying and accommodation of semiconductor devices
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first embodiment
[0066]FIG. 1 is a side view showing a structural example of a tray used in a semiconductor device carrying method according to a first embodiment of the present invention, FIG. 2 is a plan view showing the structure of the tray illustrated in FIG. 1, FIG. 3 is an enlarged plan view showing the structure of a pocket portion of the tray illustrated in FIG. 2, FIG. 4 is a partial sectional view taken along line A-A in FIG. 3 with a chip accommodated in the pocket portion, FIG. 5 is an enlarged sectional view of pocket portions, showing a structural example during conveyance of chips using the tray illustrated in FIG. 1, FIG. 6 is a plan view showing a structural example of an electronic tag, the electronic tag being constituted by a mu-chip with external antenna which is buried in the tray illustrated in FIG. 1, FIG. 7 is a circuit configuration diagram showing an example of a circuit configuration of an electronic tag which is constituted by an antenna built-in type mu-chip, FIG. 8 is...
second embodiment
[0139]FIG. 28 is a front view showing a structural example of a reel in a tape-reel (receptacle) used in a semiconductor device carrying method according to a second embodiment of the present invention, FIG. 29 is a side view showing the structure of the reel illustrated in FIG. 28, FIG. 30 is an enlarged partial plan view showing a structural example of a carrier tape to be wound round the reel illustrated in FIG. 28, FIG. 31 is a partial sectional view showing a sectional structure taken along line B-B in FIG. 30, FIG. 32 is a partial sectional view showing a sectional structure taken along line C-C in FIG. 30, and FIG. 33 is a perspective view showing a semiconductor device packing method according to the second embodiment.
[0140] In this second embodiment a tape-reel 24 shown in FIG. 33 is used as a modification of the receptacle other than tray.
[0141] The tape-reel 24 (receptacle) comprises a carrier tape 26 shown in FIGS. 30 to 32 which can accommodate plural objects to be ac...
third embodiment
[0154]FIG. 34 is a plan view showing a structural example of a tray (receptacle) with bar code used in a semiconductor device accommodating and carrying method according to a third embodiment of the present invention, FIG. 35 is a side view showing the structure of the tray illustrated in FIG. 34, and FIG. 36 is an enlarged partial side view showing a detail structure of the bar code illustrated in FIG. 35.
[0155] In this third embodiment, instead of the mu-chip 2 as a non-contact recognition type chip explained in the previous first and second embodiments, there is used a bar code 27 as means having information capable of being read in a non-contact manner.
[0156] To be more specific, such a bar code 27 as shown in FIG. 35 is provided in part of an outer periphery surface of a side wall 1g of a tray 1 shown in FIG. 34. The bar codes 27 represents various information pieces, including ID, manufacturer's name and product number of the tray 1, as well as product name, quantity and lot...
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Abstract
Description
Claims
Application Information
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