Structure of air duct and manufacturing process of the same

Abstract

A method of manufacturing an air duct is provided. First, a plastic material is heated until the plastic material is melted. Next, the molten plastic material is sucked into a mold and then the molten plastic material inside the mold is cooled to form the air duct. Finally, the air duct is removed from the mold. The air duct comprises a housing including passageway for air to flow there-through, a first air inlet / outlet formed on a side thereof, and a joint portion formed on another side thereof corresponding to the first air inlet / outlet to fix to a fan. The joint portion has a second air inlet / outlet. When the fan rotates, airflow is generated, which carries the heat generated by the operation of the devices via the second air inlet / outlet and then exits out via the first air inlet / outlet.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the invention[0002]The present invention relates to a structure of an air duct and a manufacturing process of the same. More particularly, the present invention relates to a structure of an air duct comprising a lip portion and joint portion formed two sides thereof such that the reverse flow of the heat may be prevented and the heat dissipating effect may be effectively promoted.[0003]2. Description of the Related Art[0004]The operation of the computer devices usually generate heat, which may significantly increase the temperature and may cause abnormal operation of the devices or even damage the devices. The service life of the devices may be reduced if the heat is not timely dissipated. Accordingly, it is important to dissipate the heat generated by the operation of the devices for proper operation thereof. One way of dissipating heat is by using a heat sink device comprising a fan and an air duct.[0005]In a conventional heat sink devi...

AI Technical Summary

Benefits of technology

[0006]Accordingly, in the view of the foregoing, the present invention provides a method of manufacturing an air duct capable of reducing its space occupation during the transportation and thereby reduce the transportation cost. According to an aspect of the present invention, first a plastic material is heated until the plastic material melts or softens, and then the softened plastic material is sucked into a mold having a predetermined structure of an air duct. Next, the resulting structure is cooled to form the air duct. Thus, the thickness of the air duct can be thinner than that of the conventional air duct. Furthermore, the air duct of the present invention may be stacked on each other. Thus the space occupied by the air duct can be reduced and the cost of the transportation can also be reduced.

[0007]According to another aspect of the present invention, the fan can be assembled to the air duct using buckles. Thus, not only the structure of the air duct is reinforced but also the defects due to the use of the screws, as required in the conventional air duct, may be avoided. Thus, the throughput may be increased and cost may be substantially reduced.

[0008]According to another aspect of the present invention, the air duct of the present invention comprises lip portion formed in the air inlet / outlet to prevent reverse air flow to effectively promote the heat dissipation effect.

Problems solved by technology

The operation of the computer devices usually generate heat, which may significantly increase the temperature and may cause abnormal operation of the devices or even damage the devices.

The air duct is formed by a plastic injection mold process, therefore the air duct has a thick body, which is inconvenient to stack with other components during the transportation.

Therefore, the space occupied of the air duct is large and the transportation cost is high.

Besides, the fan is fixed on the air duct using screws, which is laborious and time consuming process that would further increase the cost.

In addition, the airflow created by the fan may flow in a reverse direction that would adversely affect the heat dissipation effect of the heat sink device.

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