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Systems and methods for managing heat transfer in a fluid handling device

a technology of fluid handling and fluid flow, applied in the field of fluid handling, can solve the problems of significantly affecting the process results, new device designs cannot be implemented, and processes cannot be properly carried out, and achieve the effect of reducing temperature variations

Inactive Publication Date: 2007-12-20
ENTEGRIS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The invention is about reducing temperature variations in process fluids caused by flow control equipment. It does this by separating heat-producing components from those that handle the fluid flow. The heat-generating components are placed in one sealed enclosure, while the fluid handling components are placed in another sealed enclosure, with an air gap between them to prevent heat transfer. This results in a more stable process fluid temperature. The invention can be applied to a variety of fluid handling devices and control components."

Problems solved by technology

If this equipment cannot meet these high standards, the processes cannot be properly carried out, and the new device designs cannot be implemented.
For example, the amount or rate at which fluid which is provided in a process may significantly affect the results of the process.
In other words, while the equipment was sufficient for earlier manufacturing processes, it may not meet the needs of newer processes.
In this application, variations in the temperature of the fluid—even very minor ones—can result in variations in the thickness of the coating which is formed on the glass panel.
Because variations in the thickness of the coating cause variations in picture quality across the panel, the initial variations in the temperature of the process fluid may ultimately result in a panel being discarded for poor quality.
Although some prior art flow controllers separate the electronics of the flow controller from the fluid handling mechanism and position the electronics at a substantial distance from the fluid handling mechanism to prevent heating of the process fluid, this results in other disadvantages.
Additionally, if the control valves in the fluid handling portion of the controller are pneumatically actuated, the increased distance between the fluid handling portion and control portion of the flow controller results in reduced responsiveness.
In other words, the system may not be able to control the flow control valve quickly enough to meet the demands of the manufacturing process.

Method used

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  • Systems and methods for managing heat transfer in a fluid handling device
  • Systems and methods for managing heat transfer in a fluid handling device
  • Systems and methods for managing heat transfer in a fluid handling device

Examples

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Embodiment Construction

[0020]One or more embodiments of the invention are described below. It should be noted that these and any other embodiments described below are exemplary and are intended to be illustrative of the invention rather than limiting.

[0021]As described herein, various embodiments of the invention comprise systems and methods for reducing temperature variations induced by flow control equipment in process fluids by separating heat-producing portions of the control equipment from portions of the equipment which handle or are in close proximity to a fluid flow path.

[0022]In one embodiment, a fluid handling device (e.g., a flow controller, pump or other fluid handling device) is designed for use in manufacturing processes in which temperature control of the process fluid being handled by the flow controller is critical. Consequently, it is desirable to move components of the fluid handling device that may affect or the temperature of the process fluid away from the fluid flow path and to ther...

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PUM

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Abstract

Systems and methods for reducing temperature variations induced by fluid handling equipment in process fluids by separating heat-producing portions of the control equipment from portions of the equipment which handle or are in close proximity to a fluid flow path. In one embodiment, the fluid handling components are contained in a first enclosure, while the heat-generating components are contained in a second enclosure. An air gap is maintained between the two enclosures to provide thermal isolation of the fluid handling components from the heat-generating components. In one embodiment, the air gap is maintained by connecting the two enclosures using insulating spacers. Interconnects between components in the two enclosures may be routed through an insulating tube that is sealed at each end to prevent heat transfer through the tube.

Description

BACKGROUND[0001]1. Field of the Invention[0002]The invention relates generally to fluid handling, and more particularly to systems and methods for managing heat transfer in a fluid handling device such as a fluid flow controller of the type typically used in semiconductor processing.[0003]2. Related Art[0004]There is an increasing demand for computers and other electronic devices that provide greater numbers of features and greater computing power, and that also consume less energy. In order to keep up with this demand, new designs for devices are continually being developed. Equally important are new techniques for manufacturing the devices which often are required to enable the new device designs.[0005]Because decreasing size and increasing precision is demanded by new device designs, the precision involved in manufacturing processes must increase as well. Both the environments in which the processes are carried out and the controls over specific aspects of the processes themselve...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F1/00
CPCF28F27/00F28F2270/00G05D23/192G05D7/0635
Inventor LAVERDIERE, MARCGASHGAEE, IRAJBRODEUR, CRAIG L.MCLOUGHLIN, ROBERT F.
Owner ENTEGRIS INC