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Polishing composition and polishing method

Inactive Publication Date: 2008-01-03
MATSUNAMI YASUSHI +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The composition effectively reduces scratches and enhances the removal rate of magnetic disk substrates, maintaining surface quality and preventing machine vibration, while optimizing the content of abrasive grain and acid to achieve a high polishing performance.

Problems solved by technology

However, the polishing composition of U.S. Pat. No. 6,818,031 does not sufficiently satisfy the required performance regarding scratches and the removal rate, and there is yet room for improvements in the polishing composition.

Method used

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Examples

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Embodiment Construction

[0007] One embodiment of the present invention will now be described.

[0008] A polishing composition of the preferred embodiment is manufactured by mixing abrasive grain, acid, an oxidizing agent, a compound selected from a group consisting of azoles and its derivatives, and water. Therefore, the polishing composition of the preferred embodiment substantially consists of abrasive grain, acid, the oxidizing agent, the compound selected from the group consisting of azoles and its derivatives, and water. The polishing composition is used for polishing a magnetic disk substrate. In other words, the polishing composition is used for polishing a semi-finished product of the magnetic disk substrate to obtain the magnetic disk substrate as a polished product. The polishing composition of the preferred embodiment is preferably used in the final polishing process (finish polishing process) among polishing processes generally performed during machining of the magnetic disk substrate.

[0009] Th...

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PUM

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Abstract

A polishing composition contains abrasive grain such as colloidal silica, acid such as citric acid and orthophosphoric acid, an oxidizing agent such as hydrogen peroxide, a compound selected from a group consisting of azoles and its derivatives such as benzotriazole. The polishing composition is suitably used for polishing a magnetic disk substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a Divisional application from Ser. No. 11 / 238,256, the contents of which is hereby incorporated by reference.BACKGROUND OF THE INVENTION [0002] The present invention relates to a polishing composition that is used for polishing a magnetic disk substrate, and to a polishing method using the polishing composition. [0003] The polishing composition used for polishing the magnetic disk substrate is required to, for example, form only a small number of scratches on the surface of the magnetic disk substrate, and polish the magnetic disk substrate at a high removal rate when the polishing composition is used to polish the magnetic disk substrate. For example, U.S. Pat. No. 6,818,031 discloses a polishing composition improved to satisfy those requirements. The polishing composition of U.S. Pat. No. 6,818,031 contains organic phosphonic acid to suppress generation of scratches when the magnetic disk substrate is polished usin...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B24B7/00
CPCC09K3/1463C09K3/1409C09G1/02C09K3/14H01L21/304
Inventor MATSUNAMI, YASUSHIHIRANO, JUNICHILIN, JIE
Owner MATSUNAMI YASUSHI