Thermoelectric Refrigerating Modules

Abstract

The present invention relates to a thermoelectric refrigeration module, comprising a TEC refrigerating piece (8) having a top surface and a bottom surface, a radiator (16) closely contacted to the bottom surface of the TEC refrigerating piece (8), and a cold eliminator (18) including a brick body (4) having a bottom surface adhered to the top surface of the TEC refrigerating piece (8), characterized in that a thermal insulation frame structure (7) is disposed between the radiator (16) and the cold eliminator (18); the brick body of the cold eliminator and the TEC refrigerating piece are located within thermal insulation frame structure (7); the radiator and the cold eliminator are connected to the thermal insulation frame structure (7) via a connecting piece respectively; the cold eliminator has an end portion at which a plurality of cold aluminum fins are provided; a locating frame structure (1) having an inside frame, within which the end portion of the cold eliminator is located, is provided; the inside frame of the locating frame (1), the cold eliminator (18), and the thermal insulation frame structure (7) are sealed by a sealing device; and the locating frame structure provides a plurality of screw rods at sides thereof. The cold eliminator according to the present invention together with the TEC refrigeration piece is located within the thermal insulation frame structure which improves the refrigerating effect of the refrigeration piece.

Description

TECHNICAL FIELD OF THE INVENTION [0001] The present invention relates to a thermoelectric refrigeration module for a refrigeration apparatus and belongs to the technical field of refrigeration. BACKGROUND OF THE INVENTION [0002] Thermoelectric refrigeration technology is also referred to as semiconductor refrigeration technology or temperature difference electric refrigeration technology. Thermoelectric refrigeration achieves a refrigeration effect by means of a thermoelectric effect of special semiconductor materials. A core for this technique is utilizing a thermoelectric chip (TEC). A conventional TEC has a width of 40 mm, a length of 40 mm and a thickness of 5 mm. After a thermoelectric refrigeration chip is electrified, one side surface of the refrigeration chip will absorb heat and the other side surface thereof will emit heat. A thermoelectric refrigeration module is obtained by mounting a plurality of heat-emitting fins to the two sides of a TEC. [0003] Usually TEC fails to ...

AI Technical Summary

Benefits of technology

[0010] A technical problem to be solved in the present invention, i.e. an object of the present invention, is to provide a thermoelectric refrigeration module improving the refrigeration effect.

Problems solved by technology

Usually TEC fails to operate efficiently and reasonably due to an improper assembly and arrangement in an object.

Since a distance between the heat and cold side surfaces of the TEC is only 4-5 mm while a temperature difference between the heat and cold side surfaces of the TEC can reach up to 40-50° C., a thermal short will occur between the heat and cold side surfaces where the insulation performance between the heat and cold side surfaces is poor.

Firstly, the plastic housings themselves can conduct heat.

Further, since the refrigeration structure is arranged within the mounting hole providing gaps in which air can fill to conduct heat.

In addition, since an interface between the cold dissipation aluminum body a12 and the cold side plastic housing a22 is only sealed by sponge a15, when the TEC module works, condensed water will permeate into the sponge a15 and come into gaps of the cold dissipation aluminum body a12, resulting in heat-transferring between the heat and cold side surfaces by means of the condensed water, which indirectly counterbalances the thermal potential difference between the cold and heat side surfaces reducing the refrigeration effect.

Images