Heat dissipating assembly

Abstract

A heat dissipating assembly for dissipating heat of a heat source is provided. The heat dissipating assembly includes a body, at least one circulation pipe, and a working fluid. The body has a chamber defined therein and least one pipeline formed in a wall of the body. The body further has at least one first orifice in communication with the chamber of the body, and at least one second orifice in communication with the pipeline. The circulation pipe has two end portions respectively connected to the first orifice and the second orifice. The working fluid is accommodated in the chamber of the body, wherein the working fluid flows into the circulation pipe through the first orifice, and flows into the pipeline through the second orifice to flow back to the chamber of the body, thereby forming a two phase circulation loop.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of Invention[0002]The present invention relates to a heat dissipating assembly, and more particularly to a heat dissipating assembly having a gaseous / liquid phase circulation loop.[0003]2. Related Art[0004]Along with the development of semiconductor and electronics, the performance of computers is sufficiently enhanced. Currently, as the size of electronic components is gradually miniaturized, and the clock time of the electronic components becomes more faster, the heat generated by these electronic components is increased accordingly. If the heat generated by the electronic components cannot be dissipated in time, the temperature of the electronic components will rise quickly, the electronic components may bum out and be damaged, and thus the computer is malfunctioned.[0005]In order to cool electronic components to maintain the operation of the computer, a heatsink made of a metal is used in the prior art to absorb heat generated by the ele...

AI Technical Summary

Benefits of technology

[0011]Accordingly, the objects of the invention of the present invention is to provide a heat dissipating assembly to solve the problem is the heat pipe in the prior art, such as the dry out caused by the counter flow of the working fluid in the heat pipe, or complicated manufacturing process and high cost due to the limitation of the configuration of the heat pipe in the heatsink.

[0013]In the present invention, the pipeline is disposed to allow the working fluid introduced into the circulation pipe through the first orifice, and into the pipeline through the second orifice, so as to flow back to the chamber of the body, thus forming a gaseous / liquid phase circulation loop in a single direction, so as to significantly enhance the heat dissipation efficiency of the heat dissipating assembly in the present invention.

[0014]The present invention can avoid mutual conflicts of the gaseous and liquid working fluids in operation, and eliminate the phenomenon of counter flow or dry out phenomenon in pipeline as the working fluid stays in the heat pipe in the conventional art.

Problems solved by technology

If the heat generated by the electronic components cannot be dissipated in time, the temperature of the electronic components will rise quickly, the electronic components may bum out and be damaged, and thus the computer is malfunctioned.

However, as the heatsink or fin assembly has a limited heat dissipation surface area, the conventional heatsink using air cooling has poor heat dissipation efficiency, and cannot meet the heat dissipation requirements of great heat generated by the electronic components with high-speed clock time.

After a long-term usage, the pipe may have problems in terms of poor junction due to factors such as material deformation, and especially the water leakage.

Moreover, the pump can work only when driven by a power source, so that the entire assembly of the heatsink may be too complex.

The liquid working fluid staying in the middle section of the heat pipes becomes a resistance force for the flow of the gaseous working fluid in the heat pipes, thus seriously affecting the operation of the circulation of the working fluid in the heat pipes, and even generating counter flow, and causing dry out phenomenon at evaporation ends of the heat pipes since the supply of the liquid working fluid is interrupted.

The alteration of the circuit layout in the circuit electronic device may increase the complexity of the process, and the manufacturing cost will rise accordingly.

In addition, the over-sized electronic device does not meet the consumers' requirement of light, thin, short, small current electronic products.

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