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Alloy nanoparticles of sn-cu-ag, preparation method thereof and ink or paste using the alloy nanoparticles

a technology of alloy nanoparticles and nanoparticles, which is applied in the direction of manufacturing tools, soldering devices, and capacitors, can solve the problems of significant growth in the development of lead-free solder materials, and the difficulty of providing nanoparticles with a size of less than 50 nm, and achieves good electrical conductivity and low calcinating temperature

Inactive Publication Date: 2010-02-11
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]An aspect of the invention is to provide Sn—Cu—Ag alloy nanoparticles which exhibit good electrical conductivity and l

Problems solved by technology

It may easily control size of nanoparticles but may be difficult to provide nanoparticles having a size of less than 50 nm.
However, since wastes can contain Pb (lead) found in Sn—Pb solder materials and cause environmental pollusion, development on lead-free solder materials has been significantly growing.

Method used

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  • Alloy nanoparticles of sn-cu-ag, preparation method thereof and ink or paste using the alloy nanoparticles
  • Alloy nanoparticles of sn-cu-ag, preparation method thereof and ink or paste using the alloy nanoparticles
  • Alloy nanoparticles of sn-cu-ag, preparation method thereof and ink or paste using the alloy nanoparticles

Examples

Experimental program
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Effect test

example 1

Preparation of Alloy Nanoparticles having Sn:Cu=99.3 wt %:0.7 wt %

[0053]0.135 g of Sn(CH3COO) and 24 equivalents of polyvinyl pyrrolidone(PVP) were added into 1,5-pentanediol(1,5-PD) and dissolved by slowly heating to 200° C. under N2. When the solution was turned into a clear solution, a small amount of NaBH4 sonicated in 1,5-pentanediol was added. As soon as NaBH4 was added, the solution was turned into dark brown color which indicated the formation of Sn particles. The reaction was further performed for 10 min at the same temperature and then 5 mL of Cu(CH3COCHCOCH3)2 sonicated in 1,5-pentanediol was added into the reaction solution. The reaction solution was further reacted for 10 min to provide dispersion including alloy nanoparticles having 99.3 wt % Sn-0.7 wt % Cu. Ethanol was added to the dispersion and the mixture was then performed for the centrifugation (8000 rpm, 20 min) 3 times to remove excess amount of remaing surfactant and other organic materials to finally provide ...

example 2

Preparation of Sn:Cu:Ag=96.5 wt %:0.5 wt %:3.0 wt % Alloy Nanoparticles

[0056]Sn(CH3COO) 1.35 g and 24 equivalents of polyvinyl pyrrolidone (PVP) were added into 1,5-pentanediol(1,5-PD) and dissolved by slowly heating to 200° C. under N2. When the solution was turned into a clear solution, a small amount of NaBH4 sonicated in 1,5-pentanediol was added. As soon as NaBH4 was added, the solution was turned into dark brown color which indicated the formation of Sn particles. The reaction was further performed for 10 min at the same temperature and then a small amount of Cu(CH3COCHCOCH3)2 sonicated in 1,5-pentanediol was added into the reaction solution. The reaction solution was performed for another 10 min and then Ag(NO)3 sonicated in 1,5-pentanediol was added. The reaction solution was further reacted for 10 min to provide dispersion including alloy nanoparticles having 96.5 wt % Sn-3.0 wt % Ag-0.5 wt % Cu(weight ratio). Ethanol was added to the dispersion and the mixture was then per...

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Abstract

The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of Korean Patent Application No. 10-2008-0078611 filed with the Korean Intellectual Property Office on Aug. 11, 2008, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Technical Field[0003]The present invention relates to Sn—Cu—Ag alloy nanoparticles, a preparation method thereof and ink or paste using the alloy nanoparticles.[0004]2. Description of the Related Art[0005]Nanoparticles, which are particles having a particle size of nano scale, exhibit a number of special properties such as optical, electrnic and magnetic propertites that differ significantly from those observed in bulk material due to size-dependent properties such as quantum confinement effect and a very high surface area to volume ratio.[0006]Nanoparticle research is currently an area of intense scientific research in catalytic, electronic and magnetic, optical, and medical fields due to such...

Claims

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Application Information

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IPC IPC(8): C09D11/00C22C13/00B22F9/20B22F1/054B22F9/00B22F9/24B23K35/22B23K35/26C09D11/52H01B1/22H01B5/00H01B13/00
CPCB22F1/0018B22F9/24B22F2999/00B82Y30/00C09D11/52Y10T428/12715C22C13/00Y10T428/12708B22F2207/07B22F1/054B22F1/056B22F1/05B22F9/18
Inventor LEE, KWI-JONGLEE, HYUCK-MOSONG, HYUN-JOONJO, YUN-HWANPARK, JI-CHANBANG, JUNG-UPKIM, DONG-HOON
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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