Dissipation module,flat heat column thereof and manufacturing method for flat heat column

a technology of heat dissipation module and heat dissipation module, which is applied in the direction of tubular elements, lighting and heating apparatus, and strengthening means, etc. it can solve the problems of low welding reliability, long welding path, and increase in heat energy while using electronic devices, so as to increase the circulating flow rate of working fluid, increase the reliability of welding, and effectively enhance the effect of heat dissipation efficiency
US20100051239A1Inactive Publication Date: 2010-03-04DELTA ELECTRONICS INC
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
DELTA ELECTRONICS INC
Publication Date
2010-03-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

A manufacturing method for a flat heat column includes the steps of: providing a flat hollow tube, of which a first wick structure is disposed on the inner surface; providing at least one guiding device disposed within the flat heat tube for supporting the flat heat tube, wherein a second wick structure is disposed on the surface of the guiding device; connecting the first wick structure and the second wick structure for forming a continuous wick structure; and filling a working fluid and sealing both two ends of the flat hollow tube so as to form the flat heat column. A heat dissipation module and its flat heat column are also disclosed for applying to a heat element. The flat heat column can provide flowing path with optimum thermal conductive efficiency for the fluid therein.
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Description

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 097132974 filed in Taiwan, Republic of China on Aug. 28, 2008, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION

[0002] 1. Field of Invention

[0003] The present invention relates to a heat dissipation module and in particular to a heat dissipation module having a guiding device disposed in a hollow tube and the guiding device has a wick structure.

[0004] 2. Related Art

[0005] Accompanying the development of the technology, the number of transistors on a same unit area of the electronic device has been increasing, and this leads to an increase in heat energy while using the electronic device. The heat pipe is a simple but very effective heat dissipation device, and it has been widely applied on various electronic heat dissipation products. The heat pipe is used to transfer the energy by the latent heat p...

Claims

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