Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit Board

Abstract

The object of the invention is to provide a thermosetting resin composition which, in packaging an electronic circuit containing components incapable of withstanding elevated temperatures, employs low-melting solder particles, thereby enabling batch ref lowing and enabling packaging of components with excellent strength and toughness.

The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used.

In the above formulas, R₁ to R₆ are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal.

Description

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AI Technical Summary

Benefits of technology

The present invention relates to a new type of thermosetting resin composition that exhibits superior properties compared to existing materials. Specifically, this invention allows for better heat transfer and stronger bonding through its use of a special fluxing component that helps reduce impediments during curing. Additionally, the resulting material contains fewer defects and provides greater flexibility for design options. A unique feature of this invention involves the efficient formation of a strong resin layer around the metal filler component, which leads to increased strength and reduced contact resistance. Overall, this innovation improves performance and reliability while providing cost-effective solutions for various applications such as electronics packaging.

Problems solved by technology

The technical problem addressed in this patent text relates to finding a suitable material for attaching components in electronic circuitry without causing damage to sensitive parts while still maintaining good contact between them. Current methods require very hot temperatures, leading to slow production rates when dealing with small components. Using traditional fluxing components leads to weak connections and cracking, whereas using low-melting solder results in poor strength and durability. A solution needs to be found that allows for efficient attachment through both solder and resin, along with improved flexibility and reliability.

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