Method for manufacturing high-frequency signal transmission circuit and high-frequency signal transmission circuit device
a technology of transmission circuit and high-frequency signal, which is applied in the direction of basic electric elements, electrical apparatus, and testing/measurement of semiconductor/solid-state devices. it can solve the problems of reducing dielectric loss, dimensional error in manufacturing process, and difficulty in controlling the dimensional accuracy of hollow portions, so as to reduce reflection loss, reduce dielectric loss, and reduce the effect of dimensional error of recesses
Inactive Publication Date: 2010-07-29
SONY CORP
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- Application Information
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Benefits of technology
The method effectively decreases dimensional errors and reflection loss, enabling precise impedance matching and low dielectric loss, thus enhancing the integration and performance of high-frequency signal transmission circuits.
Problems solved by technology
However, the above-described transmission circuit having a hollow structure has the problem of causing difficulty in controlling the dimensional precision of the hollow portion and easily producing a dimensional error in the manufacturing process.
Although the dielectric loss may be decreased by forming the hollow portion, a reflection loss is increased by mismatch between characteristic impedances at a boundary between the hollow portion and the other portion of the substrate.
Method used
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Embodiment Construction
[0048]Embodiments of the present invention will be described on the basis of the drawings.
[0049]FIG. 1 is a perspective view showing a portion of a high-frequency signal transmission circuit device according to an embodiment of the invention. FIG. 2 is a sectional view of the same.
[0050]Referring to FIG. 1, a high-frequency signal transmission circuit device (simply referred to as a “circuit device” hereinafter) 10 includes a semiconductor substrate 1 and a transmission line 3 formed on the semiconductor substrate 1 with an insulating film 2 provided therebetween. In this embodiment, the circuit device 10 is, for example, a coplanar waveguide type circuit device in which the transmission line 3 includes a signal line 3a and ground lines 3b and 3c disposed on both sides of the signal line 3a. The semiconductor substrate 1 is composed of, for example, Si, GaAs, or the like. The insulating film 2 is composed of, for example, SiO2, SiN, BCB (benzocyclobutene), or the like. The materials...
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A method for manufacturing a high-frequency signal transmission circuit includes the steps of forming a groove to surround a first region on a semiconductor substrate, filling the groove with a stopper material, forming a high-frequency transmission line on the semiconductor substrate so that the transmission line extends over the first region, and etching the first region of the semiconductor substrate using the stopper material as an etching stopper to form a recess in the first region.
Description
CROSS REFERENCES TO RELATED APPLICATIONS[0001]This application is a continuation of prior application Ser. No. 11 / 409,567, filed Apr. 24, 2006, which claims the priority benefit of Japanese patent application number 2005-032701, filed in the Japanese Patent Office on Feb. 9, 2005, each of which is hereby incorporated by reference to the maximum extent allowable by law.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a method for manufacturing a high-frequency signal transmission circuit for transmitting high-frequency signals and a high-frequency signal transmission circuit device.[0004]2. Description of the Related Art[0005]Routers and the like used for cellular phones and wireless LAN (Local Area Network) have transmission circuits for high-frequency signals, such as switch circuits for high-frequency radio and the like, for transmitting and receiving signals. Types of transmission circuits include a microstrip type in which a coaxia...
Claims
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IPC IPC(8): H01L21/768H01L21/66H10N60/00
CPCH01P11/003H01L21/764
Inventor CHANG, KUEISUNG
Owner SONY CORP