Method for Encapsulating a Device in a Microcavity

a microcavity and device technology, applied in the field of encapsulation, can solve the problems of affecting the quality of microstructured devices, so as to achieve the effect of increasing yield or reliability, reducing the risk of damage, and increasing protection
US20100210073A1Inactive Publication Date: 2010-08-19INTERUNIVERSITAIR MICRO ELECTRONICS CENT (IMEC VZW) +1
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
INTERUNIVERSITAIR MICRO ELECTRONICS CENT (IMEC VZW)
Publication Date
2010-08-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.
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Description

FIELD OF THE INVENTION

[0001] The present invention is related to methods of manufacturing semiconductor devices, (especially to methods of encapsulation) and to such devices. Particular embodiments relate to microelectronic process technology, to Micro- and Nano-Electro Mechanical Systems (MEMS and NEMS) process and encapsulation or packaging technology, to methods for the 0-Level or wafer level packaging or encapsulation objects for instance MEMS devices. Such encapsulation can cause a cavity, in which an object can be located, such as to be hermetically sealed.BACKGROUND

[0002] Many micro-electromechanical systems (MEMS) require an encapsulation under vacuum or under a controlled atmosphere and pressure in order to ensure either a good performance or an acceptable lifetime of operation. The encapsulation has to be performed without the deposition of sealing material on the MEMS device, which can cause damage to the device.

[0003] The most popular approach is based on wafer bonding. Her...

Claims

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