Heat sink and method of manufacture thereof

a technology of heat sink and heat sink body, which is applied in the direction of solid-state devices, lighting and heating apparatus, and semiconductor/solid-state device details, etc., and can solve the problems of cooling fluid leakage, damage to the pipe, and pipe damag
US20100319899A1Inactive Publication Date: 2010-12-23SANSHA ELECTRIC MFG
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
SANSHA ELECTRIC MFG
Publication Date
2010-12-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

In a first process of this method of manufacturing a heat sink, into a groove, formed in a base and both of whose side surfaces are provided with projections or concave portions and whose upper portion is open, from the groove open portion, there is fitted a pipe that has a diameter smaller than the gap between the edge portions of the open portion of the groove. Next, the pipe is pressed from above the open portion of the groove and the upper portion of the pipe is deformed so that it follows the plane of the open portion of the groove, and moreover both side portions of the pipe are deformed so that they follow along the inner surfaces of both side portions of the groove. By this second process, both side portions of the pipe are engaged with the projections or concave portions.
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Description

CROSS REFERENCE

[0001] This Nonprovisional application claims priority under 35 U.S.C. §119(a) on Patent Application No. 2009-148449 filed in Japan on Jun. 23, 2009, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION

[0002] The present invention relates to a heat sink that cools a thermal component, and to a method of manufacturing such a heat sink.

[0003] Sometimes a radiator type heat sink is used for cooling a thermal component such as a semiconductor or the like. As this type of heat sink, for example, in the base of the heat sink, its upper portion may be formed by opening up channels (grooves) therein. These channels may have tapers, so that the gaps at the end portions at which they are opened are smaller than the gaps at the bottom portions of the channels. A structure for cooling a thermal component is disclosed in Japanese Patent Publication 11-510962 in which pipes are pressed into these channels and are deformed into almost the same f...

Claims

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