Heat transfer device with functions of power generation

Abstract

Provided is a heat transfer device which has a function of generating power through vibration of capillary grooves having a thin piezoelectric film deposited thereon, in addition to a heat transfer function of discharging heat transferred from a heating element to the outside.

Description

TECHNICAL FIELD[0001]The present invention relates to a heat transfer device capable of generating power, and more specifically, to a heat transfer device which not only has a heat transfer function of discharging heat transferred from a heating element to the outside, but also has a function of generating power through vibration of capillary grooves having a piezoelectric thin film deposited thereon.BACKGROUND ART[0002]Recently, as computers and various electronic apparatuses are becoming reduced in size, the internal structure thereof is being compactly integrated. Therefore, the temperature of semiconductor chips may increase due to heat generated from the inside of the electronic apparatuses. In this case, the performance of the semiconductor chips may be degraded, or the lifespan thereof may be reduced.[0003]To solve such an internal heat problem, a method of attaching a heat sink to a heating element has been conventionally used to cool down the heating element. However, when ...

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Benefits of technology

[0012]The heat transfer device according to the present invention has a function of generating power through the vibration of the capillary grooves having a thin piezoelectric film deposited thereon, in addition to the heat transfer function of discharging the heat transferred from the heating element to the outside. Therefore, since the heat transfer device can provide a heat transfer function as a cooling element and a power supply function as a power generator to small-sized electronic apparatuses, its effective value is expected to increase.

Problems solved by technology

However, when an electronic apparatus includes a plurality of heating elements for discharging a large amount of heat for a unit time, it is difficult to cool down the heat generated from the inside of the electronic apparatus with only the heat sink.

However, it is not preferable that the heat transfer device having only the cooling function is separately provided inside the electronic apparatus whose internal space is significantly reduced due to the miniaturization and integration.

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